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Package Intersil L16.5x3

Package Intersil L16.5x3

ManufacturerIntersil
SeriesDFN
Part NumberL16.5x3

16 Lead Thin Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L16.5x3
    16 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
    Rev 1, 4/15
    2.20
    3.00 A
    B 1.65 6
    PIN 1
    INDEX AREA 16 1 0.50 3.50 5.00 4.40 6
    PIN 1
    INDEX AREA 0.25
    8 b 4 9
    (4X) 0.15 0.10 M C A B
    0.40 В± 0.1 TOP VIEW BOTTOM VIEW (16X 0.60) 0.10 C 0.75 SEE DETAIL "X" (16X 0.25) C
    BASE PLANE 0.05 MAX SEATING PLANE
    0.08 C 4.40 SIDE VIEW C 0.20 REF 5 0.05 MAX (14X 0.50) DETAIL "X"
    1.65
    2.20 TYPICAL RECOMMENDED LAND PATTERN 1 NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be ...

Parametrics

FamilyTDFN
Pin Count16
Width3.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.037 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL16.5X3

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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