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Package Intersil L18.5x3

Package Intersil L18.5x3

ManufacturerIntersil
SeriesDFN
Part NumberL18.5x3

18 Lead Thin Dual Flat No-Lead Plastic Package (TDFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L18.5x3
    18 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
    Rev 2, 4/15 3.00 6
    PIN #1 INDEX AREA A B 6
    PIN 1
    INDEX AREA 18 1 4 . 40 В± 0 . 15 5.00 16X 0.50 9 0.10 M C A B
    (4X) 0.15 b 4 0.25 В± 0.05 18X 0 . 4 В± 0 . 1
    1.50 В± 0 . 15 TOP VIEW BOTTOM VIEW PACKAGE OUTLINE
    SEE DETAIL "X"
    0.10 C 0 . 75 В± 0 . 05 C BASE PLANE
    SEATING PLANE
    0.08 C SIDE VIEW
    0.50
    ( 4 . 40 TYP ) 0.25 C 0 . 15 REF 5 0 . 00 MIN.
    0 . 05 MAX. DETAIL "X" 0.6
    ( 1.50 TYP ) TYPICAL RECOMMENDED LAND PATTERN 1 NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be
    either a mold or mark feature. ...

Parametrics

FamilyTDFN
Pin Count18
Width3.00 mm
Thickness0.75 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL18.5X3

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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