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Package Intersil L6.1.6x1.6B

Package Intersil L6.1.6x1.6B

ManufacturerIntersil
SeriesDFN
Part NumberL6.1.6x1.6B

6 Lead Thin Dual Flat No-Lead Plastic Package (TDFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L6.1.6x1.6B
    6 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
    Rev 2, 05/15 1.60 0.60 R 0.20 A
    B 6
    PIN 1
    INDEX AREA 0.50BSC 1.00 1.60
    (4X) 6
    PIN #1 INDEX AREA 0.15 1.00 6X 0.25
    0.10 M C A B 6X 0.24
    1.12 TOP VIEW
    BOTTOM VIEW SEE DETAIL "X"
    0.75
    0.10 C C BASE PLANE (6X 0.6) SEATING PLANE
    0.08 C 0.000-0.50 SIDE VIEW 0.50 1.00 C 0.60 5 0 . 00 MIN.
    0 . 05 MAX. ( 6 X 0 . 25 ) DETAIL "X" 1.12 TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05
    4. Dimension b applies to the metallized terminal and is measured
    between 0.20mm and 0.30mm from the terminal tip.
    5. Tiebar shown (if present) is a non-functional feature and may ...

Parametrics

FamilyTDFN
Pin Count6
Length1.60 mm
Width1.60 mm
Thickness0.75 mm
Height max0.75 mm
Weight0.00562 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL6.1.6X1.6B

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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