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Package Intersil L8.2.5x2

Package Intersil L8.2.5x2

ManufacturerIntersil
SeriesDFN
Part NumberL8.2.5x2

8 Lead Thin Dual Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Dual Flat No-Lead Plastic Package (TDFN)
    2X L8.2.5x2 0.15 C A A D 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 2X MILLIMETERS 0.15 C B SYMBOL E
    6 MIN 0.75 0.80 -A1 -0.05 -D2
    // 0.10 SIDE VIEW D2
    (DATUM B) C 0.08 C A3 7 8 D2/2
    1 6
    INDEX
    AREA 0.20 0.25 0.30 5, 8 1.10 7, 8 2.00 BSC
    0.90 E
    E2 A
    C
    SEATING
    PLANE 0.20 REF D B NOTES 0.70 b
    TOP VIEW MAX A A3 INDEX
    AREA NOMINAL 1.00 -2.50 BSC
    1.20 e 1.30 1.40 7, 8 0.50 BSC -k 0.20 -L 0.30 0.40 0.50 8 N 8 Nd 4 2
    3
    Rev. 1 10/15 2 NX k NOTES:
    1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
    2. N is the number of terminals. (DATUM A) 3. Nd refers to the number of terminals on D. E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured
    between 0.25mm and 0.30mm from the terminal tip. NX L
    N N-1 ...

Parametrics

FamilyTDFN
Pin Count8
Thickness0.75 mm
Height max0.80 mm
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2.5X2

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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