RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil L8.3x3D

Package Intersil L8.3x3D

ManufacturerIntersil
SeriesDFN
Part NumberL8.3x3D

8 Lead Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

  • Download » PDF, 89 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.3x3D
    8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN)
    Rev 1, 3/15
    PIN 1 INDEX AREA 3.00
    B 1.45 A PIN 1 INDEX AREA 0.075 C
    4X 6X 0.50 BSC
    3.00 1.50
    REF 1.75 8X 0.25
    0.10 M C A B 8X 0.40 2.20 TOP VIEW BOTTOM VIEW SEE DETAIL X'' (8X 0.60) (8X 0.25) 0.10 C
    0.85 C (1.75) SEATING PLANE
    0.08 C (6X 0.50 BSC) SIDE VIEW
    (1.45)
    (2.20) TYPICAL RECOMMENDED LAND PATTERN c 0.20 REF 5 0~0.05 DETAIL “X” NOTES:
    1. Controlling dimensions are in mm.
    Dimensions in ( ) for reference only.
    2. Unless otherwise specified, tolerance: Decimal В±0.05
    Angular В±2В°
    3. Dimensioning and tolerancing conform to JEDEC STD MO220-D.
    4. The configuration of the pin #1 identifier is optional, but must be located
    within the zone indicated. The pin #1 identifier may be either a mold or
    mark feature.
    5. Tiebar shown (if present) is a non-functional feature and may be located ...

Parametrics

FamilyDFN
Pin Count8
Length3.00 mm
Width3.00 mm
Thickness0.90 mm
Height max0.80 mm
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.3X3D

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus