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Package Intersil L8.3x3K

Package Intersil L8.3x3K

ManufacturerIntersil
SeriesDFN
Part NumberL8.3x3K

8 Lead Thin Dual Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.3x3K
    8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
    Rev 2, 5/15
    2X 1.95
    3.00 6X 0.65 A
    B 1 PIN #1
    INDEX AREA 3.00 6
    6
    PIN 1
    INDEX AREA
    (4X) 1.50 В±0.10 0.15
    8
    TOP VIEW 8X 0.25 В±0.05 0.40 В± 0.05 4 0.10 M C A B
    2.30 В±0.10
    BOTTOM VIEW SEE DETAIL "X"
    C
    0.10 C 0.75 В±0.05 0 . 203 REF 5 C
    0 . 02 NOM.
    0 . 05 MAX. 0.08 C
    SIDE VIEW DETAIL "X" ( 2.30)
    ( 1.95) NOTES:
    ( 8X 0.50) 1. Dimensions are in millimeters. ...

Parametrics

FamilyTDFN
Pin Count8
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Weight0.0207 g
Pitch16.51 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.3X3K

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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