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Package Intersil L8.4x4B

Package Intersil L8.4x4B

ManufacturerIntersil
SeriesDFN
Part NumberL8.4x4B

8 Lead Thin Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.4x4B
    8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
    Rev 0, 05/16
    4.00 A 2.4 REF PIN #1 INDEX AREA 6X 0.80 BSC 5
    B 1 8X 0.40 В±0.10 4 5
    PIN 1
    INDEX AREA 4.00 2.45 В±0.10 0.15 (4X)
    5 8 0.10 M C A B
    0.05 M C TOP VIEW 3 8X 0.30 В±0.05
    3.38 В±0.10
    BOTTOM VIEW 3.38
    SEE DETAIL “X”
    0.75 В±0.05
    8X 0.60 0.10 C SEATING PLANE
    0.08 C SIDE VIEW
    (3.80) 2.45 4 0.2 REF
    C 0.00 MIN.
    0.05 MAX. (6X 0.8) DETAIL “X”
    (8X 0.30) TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. ...

Parametrics

FamilyTDFN
Pin Count8
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max1.00 mm
Weight0.041 g
Pitch0.80 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.4X4B

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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