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Package Intersil E20.3

Package Intersil E20.3

ManufacturerIntersil
SeriesPDIP
Part NumberE20.3

20 Lead Dual-In-Line Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Dual-In-Line Plastic Packages (PDIP)
    E20.3 (JEDEC MS-001-AD ISSUE D) N 20 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1
    INDEX
    AREA 1 2 3 INCHES N/2
    -B-AE D
    BASE
    PLANE -C-A2 SEATING
    PLANE A
    L D1 e B1 D1 A1 eC B
    0.010 (0.25) M C A B S SYMBOL MIN MAX MIN MAX NOTES A -0.210 -5.33 4 A1 0.015 -0.39 -4 A2 0.115 0.195 2.93 4.95 -B 0.014 0.022 0.356 0.558 -C
    L B1 0.045 0.070 1.55 1.77 8 eA C 0.008 0.014 C D 0.980 1.060 24.89 D1 0.005 -E 0.300 0.325 E1 0.240 0.280 eB NOTES:
    1. Controlling Dimensions: INCH. In case of conflict between English
    and Metric dimensions, the inch dimensions control.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
    of Publication No. 95.
    4. Dimensions A, A1 and L are measured with the package seated in
    JEDEC seating plane gauge GS-3.
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
    6. E and eA are measured with the leads constrained to be perpendicular to datum -C-.
    7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. ...

Parametrics

FamilyPDIP
Pin Count20
Thickness3.94 mm
Weight1.5 g
Pitch2.54 mm
Package IndexE20.3

Moldel Line

Series: PDIP (11)

Manufacturer's Classification

  • Plastic Packages
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