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Package Intersil E28.6

Package Intersil E28.6

ManufacturerIntersil
SeriesPDIP
Part NumberE28.6

28 Lead Dual-In-Line Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Dual-In-Line Plastic Packages (PDIP)
    E28.6 (JEDEC MS-011-AB ISSUE B) N 28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
    E1 INDEX
    AREA 1 2 3 INCHES N/2 SYMBOL
    -B-C-A2 SEATING
    PLANE e B1 D1 A1 eC B
    0.010 (0.25) M C A B S NOTES -0.250 -6.35 4 -0.39 -4 A2 0.125 0.195 3.18 4.95 -B 0.014 0.022 0.356 0.558 -C
    L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 -D 1.380 1.565 D1 0.005 -C eB NOTES:
    1. Controlling Dimensions: INCH. In case of conflict between English and
    Metric dimensions, the inch dimensions control.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
    Publication No. 95.
    4. Dimensions A, A1 and L are measured with the package seated in
    JEDEC seating plane gauge GS-3.
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
    6. E and eA are measured with the leads constrained to be perpendicular to datum -C-.
    7. eB and eC are measured at the lead tips with the leads unconstrained.
    eC must be zero or greater.
    8. B1 maximum dimensions do not include dambar protrusions. Dambar
    protrusions shall not exceed 0.010 inch (0.25mm). ...

Parametrics

FamilyPDIP
Pin Count28
Thickness4.06 mm
Height max6.35 mm
Weight4.39 g
Pitch2.54 mm
Package IndexE28.6

Moldel Line

Series: PDIP (11)

Manufacturer's Classification

  • Plastic Packages
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