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Package Intersil M28.3B

Package Intersil M28.3B

ManufacturerIntersil
SeriesSOIC
Part NumberM28.3B

28 Lead Wide Body Small Outline Exposed Pad Plastic Packages (EPSOIC)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Small Outline Exposed Pad Plastic Packages (EPSOIC)
    M28.3B N
    INDEX
    AREA H 0.25(0.010) M 28 LEAD WIDE BODY SMALL OUTLINE EXPOSED PAD
    PLASTIC PACKAGE B M E INCHES
    -B-1 2 SYMBOL 3 TOP VIEW
    L
    SEATING PLANE
    -A-h x 45o A D
    -C-A1 B
    0.25(0.010) M C
    0.10(0.004) C A M SIDE VIEW MAX NOTES A 0.091 -0.099 -0.001 -0.005 -B 0.014 -0.019 9 C 0.0091 -0.0125 -D 0.701 -0.711 3 E 0.292 -0.299 4 0.050 BSC -H 0.400 -0.410 -h 0.010 -0.016 5 L 0.024 -0.040 6 N α B S NOMINAL A1 e α e MIN 28
    0° 5° 7
    8° -P 0.180 0.214 0.218 11 P1 0.156 0.190 0.194 11
    Rev. 0 5/02 1 2 3 NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section
    2.2 of Publication Number 95.
    P1 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.15mm (0.006 inch) per side. N
    P ...

Parametrics

FamilySOICW-EP
Pin Count28
Weight0.75 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesWide, Exposed Pad
Package IndexM28.3B

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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