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Package Intersil M8.15C

Package Intersil M8.15C

ManufacturerIntersil
SeriesSOIC
Part NumberM8.15C

8 Lead Narrow Body Small Outline Exposed Pad Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Small Outline Exposed Pad Plastic Packages (EPSOIC)
    M8.15C N
    INDEX
    AREA H 0.25(0.010) M 8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
    PLASTIC PACKAGE B M E INCHES
    -B-1 2 SYMBOL 3 TOP VIEW
    L
    SEATING PLANE
    -A-A D
    -C-e α
    A1 B
    0.25(0.010) M C
    0.10(0.004) C A M B S SIDE VIEW MILLIMETERS MAX MIN MAX NOTES A 0.056 0.066 1.43 1.68 -A1 0.001 0.005 0.03 0.13 -B 0.0138 0.0192 0.35 0.49 9 C 0.0075 0.0098 0.19 0.25 -D 0.189 0.196 4.80 4.98 3 E 0.150 0.157 3.811 3.99 4 e h x 45° MIN 0.050 BSC 1.27 BSC -H 0.230 0.244 5.84 6.20 -h 0.010 0.016 0.25 0.41 5 L 0.016 0.035 0.41 0.89 6 8° 0° N α 8
    0° 8 7
    8° -P -0.126 -3.200 11 P1 -0.099 -2.514 11
    Rev. 1 6/05 NOTES:
    1 2 1. Symbols are defined in the “MO Series Symbol List” in Section
    2.2 of Publication Number 95. 3 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    P1 3. Dimension “D” does not include mold flash, protrusions or gate
    burrs. Mold flash, protrusion and gate burrs shall not exceed
    0.15mm (0.006 inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. ...

Parametrics

FamilySOICN-EP
Pin Count8
Weight0.075 g
Pitch1.27 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesNarrow, Exposed Pad
Package IndexM8.15C

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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