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Package Intersil M8.15F

ManufacturerIntersil
SeriesSOIC
Part NumberM8.15F

8 Lead Narrow Body Small Outline Exposed Pad Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M8.15F
    8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE
    Rev 0, 2/12 8
    INDEX 6.20 (0.244)
    5.84 (0.230) AREA DETAIL "A"
    0.89 (0.035)
    0.41 (0.016) 3.99 (0.157)
    3.81 (0.150) 1 2 0.50 (0.02)
    x 45В°
    0.25 (0.01) 3 TOP VIEW
    8В°
    0В°
    0.25 (0.010)
    0.19 (0.0075) SEATING PLANE
    1.68 (0.066)
    1.43 (0.056) 2.25
    (0.089) -C-0.10 (0.004)
    0 1.27 (0.050)
    0.46 (0.019)
    0.36 (0.014) 1 2 SIDE VIEW “A
    3 1 2 4 3 1.95
    (0.077) 8 3.25 (0.128) 4.98 (0.196) ...

Parametrics

FamilySOICN-EP
Pin Count8
Weight0.075 g
Pitch1.27 mm
Lead Free Peak Temperature260 °C
FeaturesNarrow, Exposed Pad
Package IndexM8.15F

Moldel Line

Series: SOIC (17)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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