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Package Intersil K14.C

ManufacturerIntersil
SeriesCFP
Part NumberK14.C

14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    K14.C
    14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
    Rev 0, 9/12 A
    A 0.050 (1.27 BSC)
    PIN NO. 1
    ID AREA 0.390 (9.91)
    0.376 (9.55) 1 TOP VIEW 0.022 (0.56) 0.005 (0.13)
    MIN
    3 0.015 (0.38) 0.115 (2.92)
    0.009 (0.23) 0.045 (1.14) 0.085 (2.16) 0.026 (0.66) 5 0.260 (6.60)
    0.248 (6.30) -C-BOTTOM
    METAL 0.183 (4.65) 0.370 (9.40) 0.167 (4.24) 0.270 (6.86) -H-0.03 (0.76) MIN 6 SEATING AND
    BASE PLANE 0.004 (0.10)
    -D-SIDE VIEW
    BOTTOM METAL
    0.005 (0.127) REF.
    OFFSET FROM
    CERAMIC EDGE OPTIONAL
    PIN 1 INDEX
    BOTTOM VIEW NOTES: 0.006 (0.15) 1. Index area: A notch or a pin one identification mark shall be located
    adjacent to pin one and shall be located within the shaded area shown.
    The manufacturer’s identification shall not be used as a pin one ...

Parametrics

FamilyCFP
Height max0.12 inch
Length0.38 inch
Package IndexK14.C
Pin Count14
Pitch0.05 inch
Thickness0.09 inch
Weight0.6 g
Width0.26 inch

Moldel Line

Series: CFP (17)

Manufacturer's Classification

  • Hermetic Packages
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