» Datasheets » Ceramic Packages

Package Intersil K16.E

16 Lead Ceramic Metal Seal Flatpack Package

Package Outline Drawing (POD)

• Download », PDF, 116 Kb
  Docket ↓
  Hermetic Packages for Integrated Circuits Package Outline Drawing
  K16.E
  16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
  Rev 1, 1/12 0.015 (0.38)
  0.008 (0.20) PIN NO. 1
  ID OPTIONAL 1 2 A
  A 0.050 (1.27 BSC)
  PIN NO. 1
  ID AREA 0.420
  0.400
  0.005 (0.13)
  MIN
  4 TOP VIEW
  0.022 (0.56)
  0.015 (0.38)
  0.115 (2.92)
  0.085 (2.16) 0.045 (1.14)
  0.026 (0.66) -C-6 BOTTOM
  METAL -D-0.198 (5.03)
  0.182 (4.62) 0.370 (9.40)
  0.250 (6.35) -H-0.03 (0.76) MIN 7 SEATING AND
  BASE PLANE 0.009 (0.23)
  0.004 (0.10) 0.278 (7.06) ...

Parametrics

Moldel Line

• K10.A K14.A K14.C K16.A K16.E K18.B K18.C K18.D K18.E K2.A K20.A K24.A K24.B K28.A K4.A K42.A K8.A

Manufacturer's Classification

• Hermetic Packages

Related datasheets:

• Datasheet SSM3K16FU(TE85L,F) - Toshiba MOSFET, N CH, 0.1 A, 20 V, SOT23
• Datasheet CSKT253/16E - C3 Semi THYRISTOR/DIODE MOD, 1.6 kV 250 A CSK
• Datasheet SS16-E3/61T - Vishay DIODE, RECTIFIER, 60 V, 1 A, SMA
• Datasheet PIC17C44-16E/L - Microchip Microcontrollers (MCU) 16 Kb 454 RAM 33 I/O
• Datasheet PIC17C43-16E/L - Microchip Microcontrollers (MCU) 8 Kb 454 RAM 33 I/O