16 Lead Ceramic Metal Seal Flatpack Package Package Outline Drawing (POD)- Download », PDF, 116 Kb
Docket ↓Hermetic Packages for Integrated Circuits Package Outline Drawing K16.E 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 1, 1/12 0.015 (0.38) 0.008 (0.20) PIN NO. 1 ID OPTIONAL 1 2 A A 0.050 (1.27 BSC) PIN NO. 1 ID AREA 0.420 0.400 0.005 (0.13) MIN 4 TOP VIEW 0.022 (0.56) 0.015 (0.38) 0.115 (2.92) 0.085 (2.16) 0.045 (1.14) 0.026 (0.66) -C-6 BOTTOM METAL -D-0.198 (5.03) 0.182 (4.62) 0.370 (9.40) 0.250 (6.35) -H-0.03 (0.76) MIN 7 SEATING AND BASE PLANE 0.009 (0.23) 0.004 (0.10) 0.278 (7.06) ...
ParametricsFamily | CFP |
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Height max | 0.12 inch |
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Length | 0.41 inch |
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Package Index | K16.E |
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Pin Count | 16 |
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Pitch | 0.05 inch |
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Thickness | 0.10 inch |
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Weight | 0.59 g |
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Width | 0.27 inch |
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Moldel LineSeries: CFP (17) Manufacturer's Classification
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