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Package Intersil K18.C

ManufacturerIntersil
SeriesCFP
Part NumberK18.C

18 Lead Ceramic Metal Seal Ceramic Lid Flatpack Package

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    K18.C
    18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE
    Rev 1, 4/10
    A
    0.050 BSC (1.27 BSC) A 1
    PIN NO. 1
    ID AREA 0.450 (11.43)
    0.430 (10.92) -A-2 -B-0.022 (0.56)
    0.015 (0.38)
    0.360 (9.14) MAX 0.004 M H A-B S D S 2
    0.036 M 4 0.000 (0.00) MIN H A-B S D S TOP VIEW 6
    0.045 (1.14)
    0.026 (0.66) 0.009 (0.23)
    0.004 (0.10) 0.340 (8.64)
    0.320 (8.13) -D-0.320 (8.13)
    0.280 (7.11) SEATING AND
    BASE PLANE 0.030 (0.76) MIN -C-0.030 (0.76) MIN 0.125 (3.18)
    0.095 (2.41)
    0.240 (6.10)
    0.220 (5.59) 5 0.320 (8.13)
    0.280 (7.11) -H-5
    SIDE VIEW NOTES: ...

Parametrics

FamilyCFP
Height max0.13 inch
Length0.44 inch
Package IndexK18.C
Pin Count18
Pitch0.05 inch
Weight0.78 g
Width0.33 inch

Moldel Line

Series: CFP (17)

Manufacturer's Classification

  • Hermetic Packages
Slices ↓
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