Datasheet AD8074, AD8075 (Analog Devices) - 3

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AD8074/AD8075 ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . 12.0 V Internal Power Dissipation2, 3 AD8074/AD8075 16-Lead TSSOP (RU) . 1 W Input Voltage IN0, IN1, IN2 . VEE ≤ VIN ≤ VCC OE . DGND ≤ VIN ≤ VCC Output Short Circuit Duration . Indefinite3 Storage Temperature Range . –65°C to +150°C Lead Temperature Range (Soldering 10 sec) . 300°C
PIN CONFIGURATION
NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma-
AD8074 /AD8075
nent damage to the device. This is a stress rating only; functional operation of the
OE 1 16 VCC
device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating
DGND 2 15 VCC
conditions for extended periods may affect device reliability.
G =
2Specification is for device in free air (T
IN2 3 14 OUT2
A = 25°C).
+1/+2
316-lead plastic TSSOP; θJA = 150.4°C/W. Maximum internal power dissipa- tion (P
AGND 4 13 VEE
D) should be derated for ambient temperature (T A) such that PD < (150°C – TA)/θJA.
G = IN1 5 12 OUT1 +1/+2 AGND 6 11 VCC G = IN0 7 10 OUT0 +1/+2 VEE 8 9 VEE CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although
WARNING!
the AD8074/AD8075 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
ESD SENSITIVE DEVICE
are recommended to avoid performance degradation or loss of functionality.
MAXIMUM POWER DISSIPATION 1.5
The maximum power that can be safely dissipated by the AD8074/
TJ = 150
ⴗ
C
AD8075 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the
1.0
plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junc- tion temperature of 175°C for an extended period can result in
0.5
device failure. While the AD8074/AD8075 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction
MAXIMUM POWER DISSIPATION – Watts
temperature (150°C) is not exceeded under all conditions. To
0
ensure proper operation, it is necessary to observe the maximum
–50 –30 –10 0 10 30 50 70 90
power derating curves shown in Figure 1.
AMBIENT TEMPERATURE –
ⴗ
C
Figure 1. Maximum Power Dissipation vs. Temperature Rev. B –3– Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM PRODUCT DESCRIPTION AD8074/AD8075-SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ESD CAUTION MAXIMUM POWER DISSIPATION AD8074/AD8075-TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTLINE DIMENSIONS ORDERING GUIDE