Datasheet LT3082 (Analog Devices) - 19
| Manufacturer | Analog Devices |
| Description | 200mA Single Resistor Low Dropout Linear Regulator |
| Pages / Page | 20 / 19 — PACKAGE DESCRIPTION. TS8 Package. 8-Lead Plastic TSOT-23 |
| File Format / Size | PDF / 301 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. TS8 Package. 8-Lead Plastic TSOT-23
Model Line for this Datasheet
- LT3082EDD#PBF LT3082EDD#PBF LT3082EDD#TRPBF LT3082EDD#TRPBF LT3082EST#PBF LT3082EST#PBF LT3082EST#TRPBF LT3082EST#TRPBF LT3082ETS8#PBF LT3082ETS8#TRMPBF LT3082ETS8#TRMPBF LT3082ETS8#TRPBF LT3082ETS8#TRPBF LT3082IDD#PBF LT3082IDD#PBF LT3082IDD#TRPBF LT3082IDD#TRPBF LT3082IST#PBF LT3082IST#PBF LT3082IST#TRPBF LT3082IST#TRPBF LT3082ITS8#PBF LT3082ITS8#TRMPBF LT3082ITS8#TRMPBF LT3082ITS8#TRPBF LT3082ITS8#TRPBF LT3082MPST LT3082MPST#PBF LT3082MPST#PBF LT3082MPST#TR LT3082MPST#TRPBF LT3082MPST#TRPBF
Text Version of Document
LT3082
PACKAGE DESCRIPTION TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637) 2.90 BSC 0.52 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC (NOTE 3) TS8 TSOT-23 0802 NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3082f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19
PACKAGE DESCRIPTION TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637) 2.90 BSC 0.52 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC (NOTE 3) TS8 TSOT-23 0802 NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3082f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19
