Datasheet ADIS16470 (Analog Devices) - 33

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ADIS16470 Data Sheet POWER SUPPLY CONSIDERATIONS
with an embedded processor board, using standard ribbon The ADIS16470 contains 6 µF of decoupling capacitance across cables. As a general guideline, the ADIS16470/PCBZ supports its VDD and GND pins. When the VDD voltage raises from 0 V reliable communications over ribbon cables that are up to 20 cm to 3.3 V, the charging current for this capacitor bank imposes in length. Local electromagnetic interference (EMI) conditions the following current profile (in amperes): can influence signal integrity, which may require some signal level observation with an oscilloscope, to assure reliable I ( = = 6× −6 10 × communications. DD t ) dVDD dVDD(t) C dt dt where:
Table 130. J1 Pin Assignments, Breakout Board
I
J1 Pin Number Signal Function
DD(t)is the current demand on the VDD pin during the initial power supply ramp, with respect to time. 1 RST Reset C is the internal capacitance across the VDD and GND pins (6 µF). 2 SCLK SPI VDD(t) is the voltage on the VDD pin, with respect to time. 3 CS SPI For example, if VDD fol ows a linear ramp from 0 V to 3.3 V, in 4 DOUT SPI 66 µs, the charging current is 300 mA for that timeframe. The 5 NC Not connect ADIS16470 also contains embedded processing functions that 6 DIN SPI present transient current demands during initialization or reset 7 GND Ground recovery operations. During these processes, the peak current 8 GND Ground demand reaches 250 mA and occurs at a time that is approximately 9 GND Ground 40 ms after VDD reaches 3.0 V (or ~40 ms after initiating a 10 VDD Power, 3.3 V reset sequence). 11 VDD Power, 3.3 V 12 VDD Power, 3.3 V
EVALUATION TOOLS
13 DR Data ready
Breakout Board
14 SYNC Input clock The ADIS16470/PCBZ is a breakout board that provides a 15 NC Not connect simple way to develop a prototype connection between the 16 NC Not connect ADIS16470 and an existing embedded processor platform. Figure 48 provides a top level view of the breakout board, including This breakout board already contains an ADIS16470AMLZ and dimensional locations for al the key mechanical features, such a dual row, 2 mm pitch, 16-pin header (J1). Table 130 provides as the mounting holes and the 16-pin header. Figure 49 provides the J1 pin assignments, which support direction connection an electrical schematic for this breakout board.
30.07mm ADIS1647X/PCB BREAKOUT BOARD 5.125mm 08-045113rA 1 TFD J1 16.99mm * 16 14/ 11/ 33.25mm EL L/B M 16.26mm 2 TFD 5.125mm
313
6.03mm 3.625mm
15343- Figure 48. Top Level View of the Breakout Board Rev. A | Page 32 of 34 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INTRODUCTION INERTIAL SENSOR SIGNAL CHAIN Gyroscope Data Sampling Accelerometer Data Sampling External Clock Options Inertial Sensor Calibration Bartlett Window FIR Filter Averaging/Decimating Filter REGISTER STRUCTURE SERIAL PERIPHERAL INTERFACE (SPI) DATA READY (DR) READING SENSOR DATA Burst Read Function DEVICE CONFIGURATION Memory Structure USER REGISTER MEMORY MAP USER REGISTER DEFINTIONS Status/Error Flag Indicators (DIAG_STAT) GYROSCOPE DATA Gyroscope Data Formatting X-Axis Gyroscope (X_GYRO_LOW and X_GYRO_OUT) Y-Axis Gyroscope (Y_GYRO_LOW and Y_GYRO_OUT) Z-Axis Gyroscope (Z_GYRO_LOW and Z_GYRO_OUT) Acceleration Data Accelerometer Resolution X-Axis Accelerometer (X_ACCL_LOW and X_ACCL_OUT) Y-Axis Accelerometer (Y_ACCL_LOW and Y_ACCL_OUT) Z-Axis Accelerometer (Z_ACCL_LOW and Z_ACCL_OUT) Internal Temperature (TEMP_OUT) Time Stamp (TIME_STAMP) Data Update Counter (DATA_CNTR) DELTA ANGLES X-Axis Delta Angle (X_DELTANG_LOW and X_DELTANG_OUT) Y-Axis Delta Angle (Y_DELTANG_LOW and Y_DELTANG_OUT) Z-Axis Delta Angle (Z_DELTANG_LOW and Z_DELTANG_OUT) Delta Angle Resolution DELTA VELOCITY X-Axis Delta Velocity (X_DELTVEL_LOW and X_DELTVEL_OUT) Y-Axis Delta Velocity (Y_DELTVEL_LOW and Y_DELTVEL_OUT) Z-Axis Delta Velocity (Z_DELTVEL_LOW and Z_DELTVEL_OUT) Delta Velocity Resolution CALIBRATION Calibration, Gyroscope Bias (XG_BIAS_LOW and XG_BIAS_HIGH) Calibration, Gyroscope Bias (YG_BIAS_LOW and YG_BIAS_HIGH) Calibration, Gyroscope Bias (ZG_BIAS_LOW and ZG_BIAS_HIGH) Calibration, Accelerometer Bias (XA_BIAS_LOW and XA_BIAS_HIGH) Calibration, Accelerometer Bias (YA_BIAS_LOW and YA_BIAS_HIGH) Calibration, Accelerometer Bias (ZA_BIAS_LOW and ZA_BIAS_HIGH) Filter Control Register (FILT_CTRL) Miscellaneous Control Register (MSC_CTRL) Point of Percussion Linear Acceleration Effect on Gyroscope Bias Internal Clock Mode Output Sync Mode Direct Sync Mode Pulse Sync Mode Scaled Sync Mode Decimation Filter (DEC_RATE) Data Update Rate in External Sync Modes Continuous Bias Estimation (NULL_CNFG) Global Commands (GLOB_CMD) Software Reset Flash Memory Test Flash Memory Update Self Test Factory Calibration Restore Bias Correction Update Firmware Revision (FIRM_REV) Firmware Revision Day and Month (FIRM_DM) Firmware Revision Year (FIRM_Y) Product Identification (PROD_ID) Serial Number (SERIAL_NUM) Scratch Registers (USER_SCR_1 to USER_SER_3) Flash Memory Endurance Counter (FLSHCNT_LOW and FLSHCNT_HIGH) APPLICATIONS INFORMATION ASSEMBLY AND HANDLING TIPS Package Attributes Assembly Tips PCB Layout Suggestions Underfill Process Validation and Control POWER SUPPLY CONSIDERATIONS EVALUATION TOOLS Breakout Board PC-Based Evaluation, EVAL-ADIS2 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE