Datasheet ADIS16080 (Analog Devices) - 15
| Manufacturer | Analog Devices |
| Description | ±80°/sec Yaw Rate Gyro with SPI Interface |
| Pages / Page | 17 / 15 — ADIS16080. APPLICATIONS INFORMATION ASSEMBLY. 12 ST2. FILT. SCLK. 16 CS. … |
| Revision | C |
| File Format / Size | PDF / 579 Kb |
| Document Language | English |
ADIS16080. APPLICATIONS INFORMATION ASSEMBLY. 12 ST2. FILT. SCLK. 16 CS. 1µF. DOUT. RATE. ST1. DIN. GND. AIN1. AIN2. VDRIVE V. REF. 100 1
Model Line for this Datasheet
Text Version of Document
link to page 16 link to page 8
ADIS16080 APPLICATIONS INFORMATION ASSEMBLY
The ADIS16080 is a system-in-package (SIP) that integrates
ADIS16080 12 ST2
multiple components in a land grid array (LGA). This
6 FILT J1 2 J2 1 2 SCLK
configuration offers the convenience of solder-reflow
C3 1 2 16 CS 1µF 3
installation on printed circuit boards (PCBs). When developing
3 4 DOUT 5 3 4 13 RATE
a process flow for installing ADIS16080 devices on PCBs, see
ST1 1 5 6 DIN 4
JEDEC standard document, J-STD-020C, for reflow temper-
5 6 NC 15
ature profile and processing information. The ADIS16080 can
NC 7 8 7 8
use either the Sn-PB eutectic process or the Pb-free eutectic
10 GND 8
process from this standard. See JEDEC J-STD-033 for moisture
9 10 AIN1 9 10 14 9 V AIN2 CC
sensitivity (MSL) handling requirements. The MSL rating for
7 11 11 12 VDRIVE V 11 12 REF
these devices is marked on the antistatic bags, which protect these devices from ESD during shipping and handling. Prior to
C1 C4 C2
8
1µF 1µF 1µF
1 -1 assembly, review the process flow for information about 045 06 introducing shock levels that exceed the ADIS16080’s absolute Figure 23. Electrical Schematic maximum ratings. Some PCB separation and ultrasonic cleaning processes are common areas that can introduce high levels of shock to these devices.
100 1. INTERFACE BOARD 1.050
The ADIS16080/PCBZ (see the Ordering Guide) provides the
2 × 0.925
a ADIS16080 functionality on a 1.2 inch × 1.3 inch printed circuit
J1 J2
board, which simplifies the connection to an existing processor
U1 2 × 0.673
system. The four mounting holes accommodate either M2 (2 mm)
i Sensor
or 2-56 machine screws. These boards are made of IS410 material and are 0.063 inches thick. The second level assembly uses a SAC305-compatible solder composition, which has a presolder
4 × Ø0.087 C1 M2×0.4
reflow thickness of approximately 0.005 inches. The pad pattern on the ADIS16080/PCBZ matches Figure 5. J1 and J2 are dual-
2 × 0.000
row, 2 mm (pitch) connectors that work with several ribbon
0.150
cable systems, including 3M Part Number 152212-0100-GB (ribbon-crimp connector) and 3M Part Number 3625/12 (ribbon cable).
200 035 000 865 900
7 1
0. 0. 0. 0. 0.
-1 45
× × 2 2
60 0 Figure 24. PCB Assembly View and Dimensions Rev. $ | Page 14 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SUPPLY AND COMMON CONSIDERATIONS INCREASING MEASUREMENT RANGE SETTING BANDWIDTH SELF-TEST FUNCTION CONTINUOUS SELF-TEST RATE SENSITIVE AXIS BASIC OPERATION SERIAL PERIPHERAL INTERFACE (SPI) Control Register ADC Conversion Output Data Access Output Coding Examples APPLICATIONS INFORMATION ASSEMBLY INTERFACE BOARD OUTLINE DIMENSIONS ORDERING GUIDE
ADIS16080 APPLICATIONS INFORMATION ASSEMBLY
The ADIS16080 is a system-in-package (SIP) that integrates
ADIS16080 12 ST2
multiple components in a land grid array (LGA). This
6 FILT J1 2 J2 1 2 SCLK
configuration offers the convenience of solder-reflow
C3 1 2 16 CS 1µF 3
installation on printed circuit boards (PCBs). When developing
3 4 DOUT 5 3 4 13 RATE
a process flow for installing ADIS16080 devices on PCBs, see
ST1 1 5 6 DIN 4
JEDEC standard document, J-STD-020C, for reflow temper-
5 6 NC 15
ature profile and processing information. The ADIS16080 can
NC 7 8 7 8
use either the Sn-PB eutectic process or the Pb-free eutectic
10 GND 8
process from this standard. See JEDEC J-STD-033 for moisture
9 10 AIN1 9 10 14 9 V AIN2 CC
sensitivity (MSL) handling requirements. The MSL rating for
7 11 11 12 VDRIVE V 11 12 REF
these devices is marked on the antistatic bags, which protect these devices from ESD during shipping and handling. Prior to
C1 C4 C2
8
1µF 1µF 1µF
1 -1 assembly, review the process flow for information about 045 06 introducing shock levels that exceed the ADIS16080’s absolute Figure 23. Electrical Schematic maximum ratings. Some PCB separation and ultrasonic cleaning processes are common areas that can introduce high levels of shock to these devices.
100 1. INTERFACE BOARD 1.050
The ADIS16080/PCBZ (see the Ordering Guide) provides the
2 × 0.925
a ADIS16080 functionality on a 1.2 inch × 1.3 inch printed circuit
J1 J2
board, which simplifies the connection to an existing processor
U1 2 × 0.673
system. The four mounting holes accommodate either M2 (2 mm)
i Sensor
or 2-56 machine screws. These boards are made of IS410 material and are 0.063 inches thick. The second level assembly uses a SAC305-compatible solder composition, which has a presolder
4 × Ø0.087 C1 M2×0.4
reflow thickness of approximately 0.005 inches. The pad pattern on the ADIS16080/PCBZ matches Figure 5. J1 and J2 are dual-
2 × 0.000
row, 2 mm (pitch) connectors that work with several ribbon
0.150
cable systems, including 3M Part Number 152212-0100-GB (ribbon-crimp connector) and 3M Part Number 3625/12 (ribbon cable).
200 035 000 865 900
7 1
0. 0. 0. 0. 0.
-1 45
× × 2 2
60 0 Figure 24. PCB Assembly View and Dimensions Rev. $ | Page 14 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SUPPLY AND COMMON CONSIDERATIONS INCREASING MEASUREMENT RANGE SETTING BANDWIDTH SELF-TEST FUNCTION CONTINUOUS SELF-TEST RATE SENSITIVE AXIS BASIC OPERATION SERIAL PERIPHERAL INTERFACE (SPI) Control Register ADC Conversion Output Data Access Output Coding Examples APPLICATIONS INFORMATION ASSEMBLY INTERFACE BOARD OUTLINE DIMENSIONS ORDERING GUIDE
