Datasheet LT319A (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | Dual Comparator |
| Pages / Page | 12 / 9 — PACKAGE DESCRIPTION. Please refer to … |
| File Format / Size | PDF / 197 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings
Model Line for this Datasheet
Text Version of Document
LT119A/LT319A LM119/LM319
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. N Package 14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I) .770* (19.558) .300 – .325 .130 ±.005 .045 – .065 MAX (7.620 – 8.255) (3.302 ±0.127) (1.143 – 1.651) 14 13 12 11 10 9 8 .020 (0.508) .255 ±.015* MIN .065 (6.477 ±0.381) .008 – .015 (1.651) (0.203 – 0.381) TYP +.035 .325 1 2 3 4 5 6 7 –.015 .120 .005 .018 ±.003 (0.127) N14 REV I 0711 +0.889 (3.048) .100 (0.457 ±0.076) 8.255 ( ) –0.381 MIN MIN (2.54) BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .785 .200 (19.939) .005 .300 BSC MAX (5.080) (0.127) (7.62 BSC) MAX MIN 14 13 12 11 10 9 8 .015 – .060 (0.381 – 1.524) .025 .220 – .310 (0.635) (5.588 – 7.874) RAD TYP .008 – .018 0° – 15° (0.203 – 0.457) 1 2 3 4 5 6 7 .045 – .065 .100 .125 (1.143 – 1.651) (2.54) (3.175) BSC .014 – .026 MIN (0.360 – 0.660) J14 0801 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS
OBSOLETE PACKAGE
119a319afc 9 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Applications Schematic Diagram Package Description Revision History Typical Application
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. N Package 14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I) .770* (19.558) .300 – .325 .130 ±.005 .045 – .065 MAX (7.620 – 8.255) (3.302 ±0.127) (1.143 – 1.651) 14 13 12 11 10 9 8 .020 (0.508) .255 ±.015* MIN .065 (6.477 ±0.381) .008 – .015 (1.651) (0.203 – 0.381) TYP +.035 .325 1 2 3 4 5 6 7 –.015 .120 .005 .018 ±.003 (0.127) N14 REV I 0711 +0.889 (3.048) .100 (0.457 ±0.076) 8.255 ( ) –0.381 MIN MIN (2.54) BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .785 .200 (19.939) .005 .300 BSC MAX (5.080) (0.127) (7.62 BSC) MAX MIN 14 13 12 11 10 9 8 .015 – .060 (0.381 – 1.524) .025 .220 – .310 (0.635) (5.588 – 7.874) RAD TYP .008 – .018 0° – 15° (0.203 – 0.457) 1 2 3 4 5 6 7 .045 – .065 .100 .125 (1.143 – 1.651) (2.54) (3.175) BSC .014 – .026 MIN (0.360 – 0.660) J14 0801 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS
OBSOLETE PACKAGE
119a319afc 9 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Applications Schematic Diagram Package Description Revision History Typical Application
