Datasheet ADF5000 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 4 GHz TO 18 GHz Divide-by-2 Prescaler |
| Pages / Page | 12 / 5 — Data Sheet. ADF5000. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. DD1. … |
| Revision | A |
| File Format / Size | PDF / 220 Kb |
| Document Language | English |
Data Sheet. ADF5000. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. DD1. DD2. PIN 1. GND 1. INDICATOR. 12 GND. RFIN 2. 11 RFOUT. GND 3. 10 RFOUT
Model Line for this Datasheet
Text Version of Document
Data Sheet ADF5000 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ND DD1 DD2 ND G V V G 16 15 14 13 PIN 1 GND 1 INDICATOR 12 GND RFIN 2 11 RFOUT ADF5000 GND 3 10 RFOUT TOP VIEW GND 4 (Not to Scale) 9 GND 5 6 7 8 ND NC CE ND G G NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
002
2. THE EXPOSED PADDLE MUST BE CONNECTED TO GND.
09129- Figure 2. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1, 3, 4, 5, 8, 9, GND RF Ground. Tie all ground pins together. 12, 13, 16 2 RFIN Single-Ended 50 Ω Input to the RF Prescaler. This pin is ac-coupled internally via a 3 pF capacitor. 6 NC No Connect. Do not connect to this pin. 7 CE Chip Enable. This pin is active high. When CE is brought low, the part enters power-down mode. If this functionality is not required, the pin can be left unconnected because it is pulled up internally through a weak pull-up resistor. 10 RFOUT Divided-Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. 11 RFOUT Complementary Divided Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. 14 VDD2 Voltage Supply for the Output Stage. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. VDD2 can be tied directly to VDD1. 15 VDD1 Voltage Supply for the Input Stage and Divider Block. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. EPAD The LFCSP has an exposed paddle that must be connected to GND. Rev. A | Page 5 of 12 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Evaluation Board PCB PCB Material Stack-Up Bill of Materials Application Circuit Outline Dimensions Ordering Guide
002
2. THE EXPOSED PADDLE MUST BE CONNECTED TO GND.
09129- Figure 2. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1, 3, 4, 5, 8, 9, GND RF Ground. Tie all ground pins together. 12, 13, 16 2 RFIN Single-Ended 50 Ω Input to the RF Prescaler. This pin is ac-coupled internally via a 3 pF capacitor. 6 NC No Connect. Do not connect to this pin. 7 CE Chip Enable. This pin is active high. When CE is brought low, the part enters power-down mode. If this functionality is not required, the pin can be left unconnected because it is pulled up internally through a weak pull-up resistor. 10 RFOUT Divided-Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. 11 RFOUT Complementary Divided Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. 14 VDD2 Voltage Supply for the Output Stage. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. VDD2 can be tied directly to VDD1. 15 VDD1 Voltage Supply for the Input Stage and Divider Block. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. EPAD The LFCSP has an exposed paddle that must be connected to GND. Rev. A | Page 5 of 12 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Evaluation Board PCB PCB Material Stack-Up Bill of Materials Application Circuit Outline Dimensions Ordering Guide
