Datasheet LTM8023 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 2A, 36V DC/DC Step-Down µModule |
| Pages / Page | 24 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION. … |
| File Format / Size | PDF / 538 Kb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION. PART NUMBER. PAD OR BALL FINISH. PART MARKING*. PACKAGE. MSL
Model Line for this Datasheet
Text Version of Document
LTM8023
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, RUN/SS Voltage ...40V VIN + BIAS ...56V ADJ, RT, SHARE Voltage ...5V Internal Operating Temperature VOUT, AUX ...10V (Note 2) .. –40°C to 125°C PGOOD, SYNC...30V Storage Temperature.. –55°C to 125°C BIAS ..16V Solder Temperature ... 250°C
PIN CONFIGURATION
GND (BANK 3) SHARE RT ADJ GND (BANK 3) SHARE RT ADJ 7 7 SYNC SYNC 6 PGOOD 6 PGOOD 5 RUN/SS 5 RUN/SS BIAS BIAS 4 AUX 4 AUX 3 3 VOUT VOUT (BANK 2) 2 V (BANK 2) IN 2 VIN (BANK 1) (BANK 1) 1 1 A B C D E F G H A B C D E F G H LGA PACKAGE BGA PACKAGE 50-LEAD (11.25mm × 9mm × 2.82mm) 50-LEAD (11.25mm × 9mm × 3.42mm) TJMAX = 125°C, θJA = 30.4°C/W, θJCbottom = 12.2°C/W, TJMAX = 125°C, θJA = 32.1°C/W, θJCbottom = 14.8°C/W, θJCtop = 23.9°C/W, θJB = 12.1°C/W, WEIGHT = 0.9g θJCtop = 23.7°C/W, θJB = 14.6°C/W, WEIGHT = 0.9g θ VALUES DETERMINED PER JEDEC 51-9, 51-12 θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8023EV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C LTM8023IV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C LTM8023MPV#PBF Au (RoHS) LTM8023MPV e4 LGA 3 –55°C to 125°C LTM8023EY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY SnPb (63/37) LTM8023Y e0 BGA 3 –40°C to 85°C LTM8023MPY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –55°C to 125°C LTM8023MPY SnPb (63/37) LTM8023Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8023fj 2 For more information www.linear.com/LTM8023
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, RUN/SS Voltage ...40V VIN + BIAS ...56V ADJ, RT, SHARE Voltage ...5V Internal Operating Temperature VOUT, AUX ...10V (Note 2) .. –40°C to 125°C PGOOD, SYNC...30V Storage Temperature.. –55°C to 125°C BIAS ..16V Solder Temperature ... 250°C
PIN CONFIGURATION
GND (BANK 3) SHARE RT ADJ GND (BANK 3) SHARE RT ADJ 7 7 SYNC SYNC 6 PGOOD 6 PGOOD 5 RUN/SS 5 RUN/SS BIAS BIAS 4 AUX 4 AUX 3 3 VOUT VOUT (BANK 2) 2 V (BANK 2) IN 2 VIN (BANK 1) (BANK 1) 1 1 A B C D E F G H A B C D E F G H LGA PACKAGE BGA PACKAGE 50-LEAD (11.25mm × 9mm × 2.82mm) 50-LEAD (11.25mm × 9mm × 3.42mm) TJMAX = 125°C, θJA = 30.4°C/W, θJCbottom = 12.2°C/W, TJMAX = 125°C, θJA = 32.1°C/W, θJCbottom = 14.8°C/W, θJCtop = 23.9°C/W, θJB = 12.1°C/W, WEIGHT = 0.9g θJCtop = 23.7°C/W, θJB = 14.6°C/W, WEIGHT = 0.9g θ VALUES DETERMINED PER JEDEC 51-9, 51-12 θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8023EV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C LTM8023IV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C LTM8023MPV#PBF Au (RoHS) LTM8023MPV e4 LGA 3 –55°C to 125°C LTM8023EY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY SnPb (63/37) LTM8023Y e0 BGA 3 –40°C to 85°C LTM8023MPY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –55°C to 125°C LTM8023MPY SnPb (63/37) LTM8023Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8023fj 2 For more information www.linear.com/LTM8023
