Datasheet TMC6200 (TRINAMIC) - 9
| Manufacturer | TRINAMIC |
| Description | High-power gate driver for PMSM servo or BLDC motors |
| Pages / Page | 47 / 9 — Pin. TQFP. Type Function |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
Pin. TQFP. Type Function
Model Line for this Datasheet
Text Version of Document
TMC6200 DATASHEET (Rev. 1.03 / 2019-FEB-13) 9
Pin TQFP Type Function
Charge pump capacitor input. Tie to CPO using 22nF 100V CPI 32 capacitor. In case ringing of the power supply leads to considerable supply ripple, add a 10-22Ohm series resistor. Motor supply voltage. Provide filtering capacity near pin with VS 33 short loop to GND plane. Must be tied to the positive bridge supply voltage. Severe ringing must be avoided. VCP 34 Charge pump voltage. Tie to VS using 100nF capacitor. Bootstrap capacitor positive connection. Tie to W terminal CW 36 using 470nF to 1µF, 16V or 25V ceramic capacitor. HSW 37 High side gate driver output. Bridge center and bootstrap capacitor negative connection. W 38 Connect to source pin of HS-MOSFET. Sense resistor connection for phase W. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is WSENSE 39 AI recommended. Directly connect to W, in case no sense resistor is used. Sense resistor connection for phase V. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is VSENSE 41 AI recommended. Directly connect to V, in case no sense resistor is used. Bridge center and bootstrap capacitor negative connection. V 42 Connect to source pin of HS-MOSFET. HSV 43 High side gate driver output. Bootstrap capacitor positive connection. Tie to V terminal CV 44 using 470nF to 1µF, 16V or 25V ceramic capacitor. Sense resistor connection for phase U. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is USENSE 46 AI recommended. Directly connect to U, in case no sense resistor is used. Bridge center and bootstrap capacitor negative connection. U 47 Connect to source pin of HS-MOSFET. HSU 48 High side gate driver output. Connect the exposed die pad to a GND plane. Provide as many Exposed die as possible vias for heat transfer to GND plane. Serves as GND - pad pin for the low side gate drivers and for digital logic. Ensure low loop inductivity to sense resistor GND. *(pd) denominates a pin with pulldown resistor www.trinamic.com
Pin TQFP Type Function
Charge pump capacitor input. Tie to CPO using 22nF 100V CPI 32 capacitor. In case ringing of the power supply leads to considerable supply ripple, add a 10-22Ohm series resistor. Motor supply voltage. Provide filtering capacity near pin with VS 33 short loop to GND plane. Must be tied to the positive bridge supply voltage. Severe ringing must be avoided. VCP 34 Charge pump voltage. Tie to VS using 100nF capacitor. Bootstrap capacitor positive connection. Tie to W terminal CW 36 using 470nF to 1µF, 16V or 25V ceramic capacitor. HSW 37 High side gate driver output. Bridge center and bootstrap capacitor negative connection. W 38 Connect to source pin of HS-MOSFET. Sense resistor connection for phase W. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is WSENSE 39 AI recommended. Directly connect to W, in case no sense resistor is used. Sense resistor connection for phase V. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is VSENSE 41 AI recommended. Directly connect to V, in case no sense resistor is used. Bridge center and bootstrap capacitor negative connection. V 42 Connect to source pin of HS-MOSFET. HSV 43 High side gate driver output. Bootstrap capacitor positive connection. Tie to V terminal CV 44 using 470nF to 1µF, 16V or 25V ceramic capacitor. Sense resistor connection for phase U. Connect to the motor side of the sense resistor. A 10Ω to 22Ω protection resistor is USENSE 46 AI recommended. Directly connect to U, in case no sense resistor is used. Bridge center and bootstrap capacitor negative connection. U 47 Connect to source pin of HS-MOSFET. HSU 48 High side gate driver output. Connect the exposed die pad to a GND plane. Provide as many Exposed die as possible vias for heat transfer to GND plane. Serves as GND - pad pin for the low side gate drivers and for digital logic. Ensure low loop inductivity to sense resistor GND. *(pd) denominates a pin with pulldown resistor www.trinamic.com
