Datasheet ADUM6132 (Analog Devices)

ManufacturerAnalog Devices
DescriptionIsolated Half-Bridge Driver with Integrated Isolated High-Side Supply
Pages16
Page1 (Isolated Half-Bridge Gate Driver with. Integrated Isolated High-Side …)
File Size318 Kb

Isolated Half-Bridge Gate Driver with. Integrated Isolated High-Side Supply. Data Sheet. ADuM6132. FEATURES. GENERAL DESCRIPTION

Datasheet ADUM6132 Analog Devices

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Isolated Half-Bridge Gate Driver with Integrated Isolated High-Side Supply Data Sheet ADuM6132 FEATURES GENERAL DESCRIPTION iso Power integrated isolated high-side supply
The ADuM61321 is an isolated half-bridge gate driver that
275 mW isolated dc-to-dc converter
employs the Analog Devices, Inc., iCoupler® technology to
200 mA output sink current, 200 mA output source current
provide an isolated high-side driver with an integrated 275 mW
High common-mode transient immunity: >50 kV/µs
high-side supply. This supply, provided by an internal isolated
Wide-body 16-lead SOIC package
dc-to-dc converter, powers not only the ADuM6132 high-side
Safety and regulatory approvals
output but also any external buffer circuitry that is commonly
UL recognition
used with the ADuM6132. This functionality eliminates the
3750 V rms for 1 minute per UL 1577
cost, space, and performance issues associated with external
CSA Component Acceptance Notice #5A
supply configurations such as a bootstrap circuit.
CSA/IEC 60950-1, 400 V rms
The architecture of the ADuM6132 isolates the high-side
VDE certificate of conformity (pending)
channel and the high-side power from the control and low-
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
side interface circuitry. Care has been taken to ensure close
VIORM = 560 V peak
matching between the high-side and low-side driver timing characteristics to reduce the need for a dead time margin.
APPLICATIONS
In comparison to gate drivers that employ high voltage level
MOSFET/IGBT gate drivers
translation methodologies, the ADuM6132 offers the benefit
Motor drives
of true, galvanic isolation. The differential voltage between
Solar panel inverters
high-side and low-side channels can be as high as 800 V with
Power supplies
good insulation lifetime (see Table 12). isoPower® uses high frequency switching elements to transfer power through its transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to the AN-0971 Application Note for information about board layout considerations.
FUNCTIONAL BLOCK DIAGRAM VDD 1 ISOLATED 16 VISO DC-TO-DC GND 2 CONVERTER 15 GNDISO VDDL 3 14 GNDA T VIA 4 ENCODE 13 V IF DDA AND - V -SH IB 5 12 V DE OA IFT H CO V EVEL OB 6 S EVEL 11 NC L DE L VDDB 7 10 NC
001
GND 8 9 GNDISO ADuM6132
07393- Figure 1. 1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; 7,075,329; and other pending patents.
Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 781.329.4700 ©2008–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com
Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Electrical Characteristics Package Characteristics Regulatory Information Insulation and Safety-Related Specifications DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics Recommended Operation Conditions Absolute Maximum Values ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Terminology Applications Information Typical Application Usage PCB Layout Thermal Analysis Undervoltage Lockout Propagation Delay-Related Parameters Magnetic Field Immunity Insulation Lifetime Outline Dimensions Ordering Guide