Datasheet RClamp3324P (Semtech)
| Manufacturer | Semtech |
| Description | Low Capacitance RClamp 4-Line ESD protection |
| Pages / Page | 8 / 1 — RClamp3324P. Low Capacitance RailClamp®. 4-Line Surge and ESD Protection. … |
| File Format / Size | PDF / 776 Kb |
| Document Language | English |
RClamp3324P. Low Capacitance RailClamp®. 4-Line Surge and ESD Protection. PROTECTION PRODUCTS Description. Features
Model Line for this Datasheet
Text Version of Document
RClamp3324P Low Capacitance RailClamp® 4-Line Surge and ESD Protection PROTECTION PRODUCTS Description Features
RailClamp® 3324P provides ESD protection for high- • Transient Protection to IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact) speed data interfaces. It features a high maximum ESD IEC 61000-4-4 (EFT) 4kV (5/50ns) withstand voltage of ±17kV contact and ±20kV air IEC 61000-4-5 (Lightning) 4.5A (8/20µs) discharge per IEC 61000-4-2. RClamp3324P is designed • Package design optimized for high speed layout to minimize both the ESD peak clamping and the TLP • Protects four high-speed data lines clamping. Package inductance is reduced at each pin • Working Voltage: 3.3V resulting in lower peak ESD clamping voltage. The • Low Capacitance: 0.65 pF maximum (I/O to GND) • Dynamic Resistance: 0.15 Ohms (Typ) dynamic resistance is among the industry’s lowest at • Solid-State Silicon-Avalanche Technology 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3324P to be
Mechanical Characteristics
used in applications operating in excess of 5GHz without • SGP2510P8 Package signal attenuation. Each device will protect up to four • Pb-Free, Halogen Free, RoHS/WEEE Compliant lines (two high-speed pairs). • Nominal Dimensions: 2.5 x 1.0 x 0.60 mm • Lead Finish: NiPdAu RClamp3324P is in a 10-pin SGP2510P8 package • Molding Compound Flammability Rating: UL 94V-0 measuring 2.5 x 1.0mm with a nominal height of • Marking : Marking Code + Date Code • Packaging : Tape and Reel 0.60mm. The leads have a nominal pin-to-pin pitch of 0.50mm. Flow- through package design simplifies PCB
Applications
layout and maintains signal integrity on high-speed lines. • USB 3.0 • Industrial Equipment The combination of low peak ESD clamping, low • Digital Visual Interface dynamic resistance, and innovative package design • LVDS Interfaces enables this device to provide the highest level of ESD • eSATA protection for applications such as USB 3.0, eSATA, and DisplayPort.
Nominal Dimension Functional Schematic
2.50 1 2 1.00 0.50 BSC 0.60
Nominal Dimensions in mm Device Schematic RClamp3324P
www.semtech.com
1 of 8 Final Datasheet Rev 6.1 Semtech Revision date October 4, 2016
RailClamp® 3324P provides ESD protection for high- • Transient Protection to IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact) speed data interfaces. It features a high maximum ESD IEC 61000-4-4 (EFT) 4kV (5/50ns) withstand voltage of ±17kV contact and ±20kV air IEC 61000-4-5 (Lightning) 4.5A (8/20µs) discharge per IEC 61000-4-2. RClamp3324P is designed • Package design optimized for high speed layout to minimize both the ESD peak clamping and the TLP • Protects four high-speed data lines clamping. Package inductance is reduced at each pin • Working Voltage: 3.3V resulting in lower peak ESD clamping voltage. The • Low Capacitance: 0.65 pF maximum (I/O to GND) • Dynamic Resistance: 0.15 Ohms (Typ) dynamic resistance is among the industry’s lowest at • Solid-State Silicon-Avalanche Technology 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3324P to be
Mechanical Characteristics
used in applications operating in excess of 5GHz without • SGP2510P8 Package signal attenuation. Each device will protect up to four • Pb-Free, Halogen Free, RoHS/WEEE Compliant lines (two high-speed pairs). • Nominal Dimensions: 2.5 x 1.0 x 0.60 mm • Lead Finish: NiPdAu RClamp3324P is in a 10-pin SGP2510P8 package • Molding Compound Flammability Rating: UL 94V-0 measuring 2.5 x 1.0mm with a nominal height of • Marking : Marking Code + Date Code • Packaging : Tape and Reel 0.60mm. The leads have a nominal pin-to-pin pitch of 0.50mm. Flow- through package design simplifies PCB
Applications
layout and maintains signal integrity on high-speed lines. • USB 3.0 • Industrial Equipment The combination of low peak ESD clamping, low • Digital Visual Interface dynamic resistance, and innovative package design • LVDS Interfaces enables this device to provide the highest level of ESD • eSATA protection for applications such as USB 3.0, eSATA, and DisplayPort.
Nominal Dimension Functional Schematic
2.50 1 2 1.00 0.50 BSC 0.60
Nominal Dimensions in mm Device Schematic RClamp3324P
www.semtech.com
1 of 8 Final Datasheet Rev 6.1 Semtech Revision date October 4, 2016
