Datasheet LTM8049 (Analog Devices) - 18
| Manufacturer | Analog Devices |
| Description | Dual SEPIC or Inverting μModule DC/DC Converter |
| Pages / Page | 20 / 18 — PACKAGE DESCRIPTION. BGA Package. 77-Lead (15.00mm. 9.00mm. 2.42mm). … |
| Revision | B |
| File Format / Size | PDF / 2.0 Mb |
| Document Language | English |
PACKAGE DESCRIPTION. BGA Package. 77-Lead (15.00mm. 9.00mm. 2.42mm). DIMENSIONS. SYMBOL. MIN. NOM. MAX. NOTES
Model Line for this Datasheet
Text Version of Document
LTM8049
PACKAGE DESCRIPTION BGA Package 77-Lead (15.00mm
×
9.00mm
×
2.42mm)
(Reference LTC DWG# 05-08-1964 Rev B) A Z SEE NOTES DETAIL A aaa Z E Y 6 X A2 Z SEE NOTES G PIN 1 A1 3 A ccc Z PIN “A1” B CORNER 4 C b1 b D MOLD CAP E SUBSTRATE D H1 F F H2 G DETAIL B // bbb Z H J e Øb (77 PLACES) K ddd M Z X Y eee M Z L aaa Z 7 6 5 4 3 2 1 PACKAGE TOP VIEW PACKAGE BOTTOM VIEW DETAIL B PACKAGE SIDE VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 0.000 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNA 3 TION PER JESD MS-028 AND JEP95 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 3.810
DIMENSIONS
4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
SYMBOL MIN NOM MAX NOTES
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. 0.630 ±0.025 Ø 77x 6.350 A 2.22 2.42 2.62 THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR 5.080 A1 0.50 0.60 0.70 BALL HT MARKED FEATURE A2 1.72 1.82 1.92 3.810 5. PRIMARY DATUM -Z- IS SEATING PLANE b 0.60 0.75 0.90 BALL DIMENSION 6 PACKAGE ROW AND COLUMN LABELING MAY VARY 2.540 b1 0.60 0.63 0.66 PAD DIMENSION
!
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE D 15.00 LAYOUT CAREFULLY 1.270 E 9.00 0.000 e 1.27 1.270 F 12.70 G 7.62 2.540 H1 0.27 0.32 0.37 SUBSTRATE THK 3.810 H2 1.45 1.50 1.55 MOLD CAP HT LTMXXXXXX aaa 0.15 µModule 5.080 bbb 0.10 COMPONENT 6.350 ccc 0.20 PIN “A1” ddd 0.30 SUGGESTED PCB LAYOUT eee 0.15 TOP VIEW TRAY PIN 1 TOTAL NUMBER OF BALLS: 77 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 77 0517 REV B Rev B 18 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts
PACKAGE DESCRIPTION BGA Package 77-Lead (15.00mm
×
9.00mm
×
2.42mm)
(Reference LTC DWG# 05-08-1964 Rev B) A Z SEE NOTES DETAIL A aaa Z E Y 6 X A2 Z SEE NOTES G PIN 1 A1 3 A ccc Z PIN “A1” B CORNER 4 C b1 b D MOLD CAP E SUBSTRATE D H1 F F H2 G DETAIL B // bbb Z H J e Øb (77 PLACES) K ddd M Z X Y eee M Z L aaa Z 7 6 5 4 3 2 1 PACKAGE TOP VIEW PACKAGE BOTTOM VIEW DETAIL B PACKAGE SIDE VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 0.000 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNA 3 TION PER JESD MS-028 AND JEP95 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 3.810
DIMENSIONS
4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
SYMBOL MIN NOM MAX NOTES
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. 0.630 ±0.025 Ø 77x 6.350 A 2.22 2.42 2.62 THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR 5.080 A1 0.50 0.60 0.70 BALL HT MARKED FEATURE A2 1.72 1.82 1.92 3.810 5. PRIMARY DATUM -Z- IS SEATING PLANE b 0.60 0.75 0.90 BALL DIMENSION 6 PACKAGE ROW AND COLUMN LABELING MAY VARY 2.540 b1 0.60 0.63 0.66 PAD DIMENSION
!
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE D 15.00 LAYOUT CAREFULLY 1.270 E 9.00 0.000 e 1.27 1.270 F 12.70 G 7.62 2.540 H1 0.27 0.32 0.37 SUBSTRATE THK 3.810 H2 1.45 1.50 1.55 MOLD CAP HT LTMXXXXXX aaa 0.15 µModule 5.080 bbb 0.10 COMPONENT 6.350 ccc 0.20 PIN “A1” ddd 0.30 SUGGESTED PCB LAYOUT eee 0.15 TOP VIEW TRAY PIN 1 TOTAL NUMBER OF BALLS: 77 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 77 0517 REV B Rev B 18 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts