Datasheet LTC3310S (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 5V, 10A Synchronous Step-Down Silent Switcher 2 in 3mm x 3mm LQFN |
| Pages / Page | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revision | B |
| File Format / Size | PDF / 2.9 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART. FINISH. MSL. LEAD FREE FINISH. MARKING. CODE
Model Line for this Datasheet
Text Version of Document
LTC3310S
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN ... –0.3V to 6V TOP VIEW EN, SSTT ... –0.3V to Lesser of (VIN + 0.3V) or 6V MODE/SYNC .. –0.3V to Lesser of (V FB ITH SSTT RT IN + 0.3V) or 6V RT .. –0.3V to Lesser of (V 18 17 16 15 IN + 0.3V) or 6V EN 1 14 PGOOD FB .. –0.3V to Lesser of (VIN + 0.3V) or 6V PGOOD ... –0.3V to 6V AGND 2 13 MODE/SYNC I 19 VIN 3 12 VIN PGOOD ..5mA PGND Operating Junction Temperature Range (Notes 2, 3) VIN 4 11 VIN LTC3310SE ... –40˚C to +125°C PGND 5 10 PGND LTC3310SI ...–40˚C to +125˚C 6 7 8 9 Storage Temperature...–65˚C to +150°C SW SW SW SW Maximum Reflow (Package Body) Temperature ...260°C LQFN PACKAGE 18-LEAD (3mm × 3mm) θJA = 42°C/W, θJCbottom = 9°C/W, θJCtop = 62°C/W, θJB = 14°C/W ΨJT = 1.25°C/W, θ VALUES DETERMINED PER JESD51-12 EXPOSED PAD (PIN 19) IS PGND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART FINISH MSL LEAD FREE FINISH MARKING CODE PAD FINISH PACKAGE DESCRIPTION RATING TEMPERATURE RANGE
LTC3310SEV#PBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#PBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SEV#TRPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#TRPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SEV#TRMPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#TRMPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. LGA and BGA Package and Tray Drawings. Rev. B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN ... –0.3V to 6V TOP VIEW EN, SSTT ... –0.3V to Lesser of (VIN + 0.3V) or 6V MODE/SYNC .. –0.3V to Lesser of (V FB ITH SSTT RT IN + 0.3V) or 6V RT .. –0.3V to Lesser of (V 18 17 16 15 IN + 0.3V) or 6V EN 1 14 PGOOD FB .. –0.3V to Lesser of (VIN + 0.3V) or 6V PGOOD ... –0.3V to 6V AGND 2 13 MODE/SYNC I 19 VIN 3 12 VIN PGOOD ..5mA PGND Operating Junction Temperature Range (Notes 2, 3) VIN 4 11 VIN LTC3310SE ... –40˚C to +125°C PGND 5 10 PGND LTC3310SI ...–40˚C to +125˚C 6 7 8 9 Storage Temperature...–65˚C to +150°C SW SW SW SW Maximum Reflow (Package Body) Temperature ...260°C LQFN PACKAGE 18-LEAD (3mm × 3mm) θJA = 42°C/W, θJCbottom = 9°C/W, θJCtop = 62°C/W, θJB = 14°C/W ΨJT = 1.25°C/W, θ VALUES DETERMINED PER JESD51-12 EXPOSED PAD (PIN 19) IS PGND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART FINISH MSL LEAD FREE FINISH MARKING CODE PAD FINISH PACKAGE DESCRIPTION RATING TEMPERATURE RANGE
LTC3310SEV#PBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#PBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SEV#TRPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#TRPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SEV#TRMPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) LTC3310SIV#TRMPBF LHCN e4 Au(RoHS) 18-Lead (3mm × 3mm) LQFN (Laminate MSL3 –40°C to 125°C Package with QFN Footprint) Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. LGA and BGA Package and Tray Drawings. Rev. B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
