Datasheet BD70522GUL (Rohm) - 3

ManufacturerRohm
DescriptionUltra Low Iq Buck Converter For Low Power Applications
Pages / Page28 / 3 — BD70522GUL. Pin Configuration. Pin Descriptions. Block Diagram. …
File Format / SizePDF / 2.7 Mb
Document LanguageEnglish

BD70522GUL. Pin Configuration. Pin Descriptions. Block Diagram. TSZ02201-0Q1Q0AJ00400-1-2. 21.Aug.2017 Rev.002

BD70522GUL Pin Configuration Pin Descriptions Block Diagram TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002

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BD70522GUL Pin Configuration
1 2 3 A PGND LX VIN B VOUT AGND EN C PG VSEL2 VSEL1 Top View Figure 2. Pin Configuration
Pin Descriptions
Pin No. Pin Name Description A1 PGND Power Ground Pin A2 LX Switching Pin. Connect an inductor to this pin. A3 VIN Power Supply Input Pin. Connect an input capacitor close to this pin. Feedback Pin for internal feedback divider network and regulation loop. B1 VOUT This pin is also used for VOUT discharge while EN pin is set to low. B2 AGND Analog Ground Pin Enable Pin. This pin must be terminated. High : Enable B3 EN Low : Shutdown Do not pull up EN terminal higher than VIN voltage. Power Good Open Drain Output Pin. PG remains low while the VOUT pin voltage C1 PG is lower than the threshold voltage. If not used, this pin can be left open. Do not pull up PG terminal to a voltage which is higher than VIN voltage. Output Voltage Selection Pins. C2 VSEL2 These pins have three states : High = VIN (Connect these pins to VIN directly without pull up resistors) Low = GND (Connect these pins to GND directly without pull down resistors) C3 VSEL1 OPEN = No Connection (PCB:C<50pF, R>1Mohm) The setting of these pins cannot be changed while the IC is operating.
Block Diagram
Ultra Low Power VOUT EN Reference UVLO VOUT EN Discharge Soft VSEL1 Internal Start Feedback VFB Network UVLO 100% ON Mode Comp Comp VIN VSEL2 VIN VIN VTH_UVLO V100TH_REF AGND Main UVLO Comp Main Limit Current Ref High Side Limit Comp LX ULP Control PG Comp PG ULP Logic Zero Cross Comp Ref Comp Limit VTH_PG EN Low Side Current PGND Limit Comp Figure 3. Block Diagram www.rohm.com
TSZ02201-0Q1Q0AJ00400-1-2
© 2017 ROHM Co., Ltd. All rights reserved. 3/24 TSZ22111 • 15 • 001
21.Aug.2017 Rev.002
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Contents Pin Configuration Pin Descriptions Block Diagram Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Detailed Descriptions Typical Performance Curves Figure 7. Efficiency vs Output Current Figure 8. Efficiency vs Output Current Figure 9. Efficiency vs Output Current Figure 10. Efficiency vs Output Current Figure 11. Output Voltage vs Output Current Figure 12. Output Voltage vs Output Current Figure 13. Output Voltage vs Output Current Figure 14. Output Voltage vs Output Current Figure 15. Switching Frequency vs Output Current Figure 16. Switching Frequency vs Output Current Figure 17. Switching Frequency vs Output Current Figure 18. Switching Frequency vs Output Current Figure 19. Output Ripple Voltage vs Output Current Figure 20. Output Ripple Voltage vs Output Current Figure 21. Output Ripple Voltage vs Output Current Figure 22. Output Ripple Voltage vs Output Current Figure 23. Load Transient Response Figure 24. Load Transient Response Figure 25. Load Transient Response Figure 26. Load Transient Response Figure 27. Line Transient Response Figure 28. Line Transient Response Figure 29. Line Transient Response Figure 30. Line Transient Response Figure 31. Line Transient Response Figure 32. Line Transient Response Figure 33. Line Transient Response Figure 34. Line Transient Response Figure 35. Startup Figure 36. Startup Figure 37. Shutdown Figure 38. Shutdown Figure 39. Input Voltage Ramp Up/Down Figure 40. Input Voltage Ramp Up/Down Figure 41. Input Voltage Ramp Up/Down Figure 42. Input Voltage Ramp Up/Down Timing Chart Application Examples I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Operation Under Strong Electromagnetic Field 8. Testing on Application Boards 9. Inter-pin Short and Mounting Errors 10. Unused Input Pins 11. Regarding the Input Pin of the IC 12. Ceramic Capacitor 13. Area of Safe Operation (ASO) 14. Thermal Shutdown Circuit(TSD) 15. Over Current Protection Circuit (OCP) 16. Disturbance Light Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History
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