Datasheet TB67B000HG (Toshiba) - 10

ManufacturerToshiba
DescriptionBi-CMOS Power Integrated Circuit Multi-Chip Package (MCP). High voltage 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Driver
Pages / Page32 / 10 — TB67B000HG. Input. hysteresis. VH. (1). (Note). ±1.5. ±7.5. ±13.5. mV. H. …
File Format / SizePDF / 464 Kb
Document LanguageEnglish

TB67B000HG. Input. hysteresis. VH. (1). (Note). ±1.5. ±7.5. ±13.5. mV. H. Vrefout. −. 1. ―. Vrefout. Hall. IC. input. VIN4. HUP,. HVP,. HWP:. HUM,HVM,HWM=Vrefout/2. V. L

TB67B000HG Input hysteresis VH (1) (Note) ±1.5 ±7.5 ±13.5 mV H Vrefout − 1 ― Vrefout Hall IC input VIN4 HUP, HVP, HWP: HUM,HVM,HWM=Vrefout/2 V L

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TB67B000HG Input hysteresis VH (1) (Note) ±1.5 ±7.5 ±13.5 mV H Vrefout − 1 ― Vrefout Hall IC input VIN4 HUP, HVP, HWP: HUM,HVM,HWM=Vrefout/2 V L 0 ― 0.8 Current detection Vdc Idc, 0.475 0.5 0.525 V VFG (H) IOUT = 2 mA FG 4 ― ― VFG (L) IOUT = −2 mA FG ― ― 1 Output voltage Vrefout1 IOUT = 15 mA Vrefout 4.7 5.0 5.3 V Vrefout2 IOUT = 35 mA Vrefout 4.5 5.0 5.3 Vreg IOUT = 30 mA Vreg 6.5 7 7.5 VCEsatH VCC = 15 V, IC = 1 A, High side ― 2.3 3.2 Output saturated voltage V VCEsatL VCC = 15 V, IC = 1 A, Low side ― 2.3 3.2 VFH IF = 1 A, High side ― 2.1 3.1 Forward voltage of FRD V VFL IF = 1 A, Low side ― 2.1 3.1 Forward voltage of BSD VF (BSD) IF = 500 μA ― 0.9 1.2 V TSD 135 ― 185 Over heat protection (Note ) °C TSDhys ― 50 ― VCC VCC (H) Undervoltage positive-going threshold 10.5 11.5 12.5 Undervoltage lockout V (Driver) VCC (L) Undervoltage negative-going threshold 10 11 12 VBS (H) Undervoltage positive-going threshold 8.5 9.5 10.5 VBS Undervoltage lockout V (Driver) VBS (L) Undervoltage negative-going threshold 8 9 9.5 ton VBB = 280 V, VCC = 15 V, IC = 1 A ― 1.2 3 Output delay time μs toff VBB = 280 V, VCC = 15 V, IC = 1 A ― 1 3 Input delay time TDC Idc (fosc = 5 MHz) ― 3.5 ― μs FRD reverse recovery time trr VBB = 280 V, VCC = 15 V, IC = 1 A ― 150 ― ns (Note): Toshiba does not implement testing before shipping. 10 2013-5-9 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) Features Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings (Ta = 25°C) Operating conditions (Ta = 25°C) Package Power Dissipation Electrical Characteristics (Ta = 25°C) Functional Description Timing Chart of FG Signal Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit External Parts Package Dimensions
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