Datasheet MLX75027 (Melexis) - 10
| Manufacturer | Melexis |
| Description | VGA Time-of-Flight Sensor |
| Pages / Page | 67 / 10 — MLX75027 VGA Time-of-Flight Sensor. Parameter. Min. Typ. Max. Unit |
| File Format / Size | PDF / 3.2 Mb |
| Document Language | English |
MLX75027 VGA Time-of-Flight Sensor. Parameter. Min. Typ. Max. Unit
Model Line for this Datasheet
Text Version of Document
MLX75027 VGA Time-of-Flight Sensor
PRELIMINARY DATASHEET 3.3.
Video Interface MLX75027 is fully compliant with the hardware description as described in the MIPI Alliance Specification for D-PHY version 1.20.00, released in September 2014. For a more detailed description about the parameters please consult the D-PHY MIPI documentation. 3.3.1.
MIPI DC specification
Parameter Min. Typ. Max. Unit
VOHHS 360 mV VOD 140 270 mV dVOD 14 mV HSDC VCMTX 150 250 mV dVCMTX 5 mV ZOS 40 62.5 Ω VOH 1.1 1.3 V LPDC VOL -50 50 mV ZOLP 110 Ω Table 6: MIPI DC specification Note: For a detailed explanation of the different parameters, please consult the MIPI D-PHY specifications v1.20.00. Figure 3: MIPI DC layout 3.3.2.
MIPI AC specification
Parameter Min. Typ. Max. Unit
Trise, Tfall 50 312.5 psec HSAC dVCMTX(>400MHz) 15 mVrms dVCMTX(50-400MHz) 25 mVpeak Trise, Tfall 25 ns Slew rate with Cload=0pF 500 mV/nsec LPAC Slew rate with Cload=5pF 300 mV/nsec Slew rate with Cload=20pF 250 mV/nsec Slew rate with Cload=70pF 150 mV/nsec Table 7: MIPI AC specification Note: For a detailed explanation of the different parameters, please consult the MIPI D-PHY specifications v1.20.00. Preliminary Datasheet v0.9 Page 10 of 67 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. VGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function ) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Information 10.1. Transmittance and Reflectance 10.2. Pinout & Equivalent I/O Circuitry 10.3. Mechanical Dimensions 10.4. Package Marking 10.5. PCB Landing Pattern 10.6. Reflow Solder Profile 10.7. Reflow Cleaning Instructions 10.8. Cover Tape Removal Disclaimer
PRELIMINARY DATASHEET 3.3.
Video Interface MLX75027 is fully compliant with the hardware description as described in the MIPI Alliance Specification for D-PHY version 1.20.00, released in September 2014. For a more detailed description about the parameters please consult the D-PHY MIPI documentation. 3.3.1.
MIPI DC specification
Parameter Min. Typ. Max. Unit
VOHHS 360 mV VOD 140 270 mV dVOD 14 mV HSDC VCMTX 150 250 mV dVCMTX 5 mV ZOS 40 62.5 Ω VOH 1.1 1.3 V LPDC VOL -50 50 mV ZOLP 110 Ω Table 6: MIPI DC specification Note: For a detailed explanation of the different parameters, please consult the MIPI D-PHY specifications v1.20.00. Figure 3: MIPI DC layout 3.3.2.
MIPI AC specification
Parameter Min. Typ. Max. Unit
Trise, Tfall 50 312.5 psec HSAC dVCMTX(>400MHz) 15 mVrms dVCMTX(50-400MHz) 25 mVpeak Trise, Tfall 25 ns Slew rate with Cload=0pF 500 mV/nsec LPAC Slew rate with Cload=5pF 300 mV/nsec Slew rate with Cload=20pF 250 mV/nsec Slew rate with Cload=70pF 150 mV/nsec Table 7: MIPI AC specification Note: For a detailed explanation of the different parameters, please consult the MIPI D-PHY specifications v1.20.00. Preliminary Datasheet v0.9 Page 10 of 67 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. VGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function ) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Information 10.1. Transmittance and Reflectance 10.2. Pinout & Equivalent I/O Circuitry 10.3. Mechanical Dimensions 10.4. Package Marking 10.5. PCB Landing Pattern 10.6. Reflow Solder Profile 10.7. Reflow Cleaning Instructions 10.8. Cover Tape Removal Disclaimer
