Datasheet LT3380 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Multioutput Power Management Solution with 4 Buck Switching and 3 LDO Linear Regulators with I2C |
| Pages / Page | 28 / 5 — ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply … |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply over the specified operating
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ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = PVIN1 = PVIN2 = PVIN3 = PVIN4 = VIN_L1 = VIN_L2 = VIN_L3 = DVDD = 3.8V. All regulators disabled unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS I2C Port
DVVDD DVDD Input Supply Voltage l 1.6 5.5 V IDVDD DVDD Quiescent Current SCL/SDA = 0kHz 0.3 1 µA DVVDD_UVLO DVDD UVLO Level 1 V ADDRESS LT3380 Device Address 0111100[R/W] VIH SDA/SCL Input Threshold Rising 70 %DVDD VIL SDA/SCL Input Threshold Falling 30 %DVDD IIH SDA/SCL High Input Current SDA = SCL = 5.5V –1 0 1 µA IIL SDA/SCL Low Input Current SDA = SCL = 0V –1 0 1 µA VOL_SDA SDA Output Low Voltage ISDA = 3mA 0.4 V fSCL Clock Operating Frequency 400 kHz tBUF Bus Free Time Between Stop and Start 1.3 µs Condition tHD, STA Hold Time After Repeated Start Condition 0.6 µs tSU, STA Repeated Start Condition Setup Time 0.6 µs tSU, STO Stop Condition Setup Time 0.6 µs tHD, DAT(O) Data Hold Time Output 0 900 ns tSU, DAT Data Setup Time 100 ns tLOW SCL Clock Low Period 1.3 µs tHIGH SCL Clock High Period 0.6 µs tf Clock/Data Fall Time CB = Capacitance of BUS Line (pF) 20 + 0.1CB 300 ns tr Clock/Data Rise Time CB = Capacitance of BUS Line (pF) 20 + 0.1CB 300 ns tSP Input Spike Suppression Pulse Width 50 ns
Note 1:
Stresses beyond those listed Under Absolute Maximum Ratings Note that the maximum ambient temperature consistent with these may cause permanent damage to the device. Exposure to any Absolute specifications is determined by specific operating conditions in Maximum rating condition for extended periods may affect device conjunction with board layout, the rated package thermal impedance and reliability and lifetime. other environmental factors.
Note 2:
The LT3380 is tested under pulsed load conditions such that
Note 3:
The LT3380 includes overtemperature protection that is intended TJ ≈ TA. The LT3380E is guaranteed to meet specifications from to protect the device during momentary overload conditions. Junction 0°C to 85°C junction temperature. Specifications over the –40°C to temperature will exceed 150°C when overtemperature protection is active. 125°C operating junction temperature range are assured by design, Continuous operation above the specified maximum operating junction characterization and correlation with statistical process controls. The temperature may impair device reliability. LT3380I is guaranteed over the –40°C to 125°C operating junction
Note 4:
Dropout voltage is defined as (VIN_Lx – VLDOx) when VLDOx is 3% temperature range and the LT3380H is guaranteed over the full –40°C to lower than VLDOx measured with VIN = VIN_Lx = 4.3V. 150°C operating junction temperature range. High junction temperatures
Note 5:
Dynamic supply current is higher due to the gate charge being degrade operating lifetimes; operating lifetime is derated for junction delivered at the switching frequency. temperatures greater than 125°C. The junction temperature (TJ in °C) is calculated from the ambient temperature (T
Note 6:
Soft-Start measured in test mode with regulator error amplifier in A in °C) and power dissipation (P unity-gain mode. D, in Watts), and package to junction ambient thermal impedance (J
Note 7:
The LT3380 will operate before V A in Watts/°C ) according to the formula: IN has risen higher than VIN T undervoltage fault rising (2.65V max) but will shutdown if VIN does not J = TA + (PD • JA). cross the rising threshold in less than 5 seconds. Please refer to the Operation section. Rev. 0 For more information www.analog.com 5 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Introduction Step-Down Switching Regulators Slewing DAC Reference Operation Power On Sequencing Power Off Sequencing Fault Detectionand Reporting I2C Operation Applications Information Thermal Considerations and Board Layout Typical Applications Package Description Typical Application Related Parts
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = PVIN1 = PVIN2 = PVIN3 = PVIN4 = VIN_L1 = VIN_L2 = VIN_L3 = DVDD = 3.8V. All regulators disabled unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS I2C Port
DVVDD DVDD Input Supply Voltage l 1.6 5.5 V IDVDD DVDD Quiescent Current SCL/SDA = 0kHz 0.3 1 µA DVVDD_UVLO DVDD UVLO Level 1 V ADDRESS LT3380 Device Address 0111100[R/W] VIH SDA/SCL Input Threshold Rising 70 %DVDD VIL SDA/SCL Input Threshold Falling 30 %DVDD IIH SDA/SCL High Input Current SDA = SCL = 5.5V –1 0 1 µA IIL SDA/SCL Low Input Current SDA = SCL = 0V –1 0 1 µA VOL_SDA SDA Output Low Voltage ISDA = 3mA 0.4 V fSCL Clock Operating Frequency 400 kHz tBUF Bus Free Time Between Stop and Start 1.3 µs Condition tHD, STA Hold Time After Repeated Start Condition 0.6 µs tSU, STA Repeated Start Condition Setup Time 0.6 µs tSU, STO Stop Condition Setup Time 0.6 µs tHD, DAT(O) Data Hold Time Output 0 900 ns tSU, DAT Data Setup Time 100 ns tLOW SCL Clock Low Period 1.3 µs tHIGH SCL Clock High Period 0.6 µs tf Clock/Data Fall Time CB = Capacitance of BUS Line (pF) 20 + 0.1CB 300 ns tr Clock/Data Rise Time CB = Capacitance of BUS Line (pF) 20 + 0.1CB 300 ns tSP Input Spike Suppression Pulse Width 50 ns
Note 1:
Stresses beyond those listed Under Absolute Maximum Ratings Note that the maximum ambient temperature consistent with these may cause permanent damage to the device. Exposure to any Absolute specifications is determined by specific operating conditions in Maximum rating condition for extended periods may affect device conjunction with board layout, the rated package thermal impedance and reliability and lifetime. other environmental factors.
Note 2:
The LT3380 is tested under pulsed load conditions such that
Note 3:
The LT3380 includes overtemperature protection that is intended TJ ≈ TA. The LT3380E is guaranteed to meet specifications from to protect the device during momentary overload conditions. Junction 0°C to 85°C junction temperature. Specifications over the –40°C to temperature will exceed 150°C when overtemperature protection is active. 125°C operating junction temperature range are assured by design, Continuous operation above the specified maximum operating junction characterization and correlation with statistical process controls. The temperature may impair device reliability. LT3380I is guaranteed over the –40°C to 125°C operating junction
Note 4:
Dropout voltage is defined as (VIN_Lx – VLDOx) when VLDOx is 3% temperature range and the LT3380H is guaranteed over the full –40°C to lower than VLDOx measured with VIN = VIN_Lx = 4.3V. 150°C operating junction temperature range. High junction temperatures
Note 5:
Dynamic supply current is higher due to the gate charge being degrade operating lifetimes; operating lifetime is derated for junction delivered at the switching frequency. temperatures greater than 125°C. The junction temperature (TJ in °C) is calculated from the ambient temperature (T
Note 6:
Soft-Start measured in test mode with regulator error amplifier in A in °C) and power dissipation (P unity-gain mode. D, in Watts), and package to junction ambient thermal impedance (J
Note 7:
The LT3380 will operate before V A in Watts/°C ) according to the formula: IN has risen higher than VIN T undervoltage fault rising (2.65V max) but will shutdown if VIN does not J = TA + (PD • JA). cross the rising threshold in less than 5 seconds. Please refer to the Operation section. Rev. 0 For more information www.analog.com 5 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Introduction Step-Down Switching Regulators Slewing DAC Reference Operation Power On Sequencing Power Off Sequencing Fault Detectionand Reporting I2C Operation Applications Information Thermal Considerations and Board Layout Typical Applications Package Description Typical Application Related Parts
