Datasheet MAX40108 (Analog Devices) - 3

ManufacturerAnalog Devices
Description1V, Low-Power, Precision Operational Amplifier
Pages / Page13 / 3 — Absolute Maximum Ratings. Package Information. WLP. Thermal Resistance, …
File Format / SizePDF / 587 Kb
Document LanguageEnglish

Absolute Maximum Ratings. Package Information. WLP. Thermal Resistance, Four-Layer Board:. TDFN. Electrical Characteristics

Absolute Maximum Ratings Package Information WLP Thermal Resistance, Four-Layer Board: TDFN Electrical Characteristics

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link to page 5 MAX40108 1V, Low-Power, Precision Operational Amplifier
Absolute Maximum Ratings
VDD to GND.. -0.3V to +4V Output Short-Circuit Duration to Either VDD or GND ..Continuous IN+ to IN- .. -0.3V to VDD + 0.3V Continuous Power Dissipation (Derate 10.51mW/°C above OUT to GND ... -0.3V to VDD + 0.3V +70°C)..840.78mW IN+, IN- to GND ... -0.3V to VDD + 0.3V Operating Temperature Range ...-40°C to +125°C Continuous Current into Any Input/Output Pin .. 10mA Junction Temperature ... +150°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information WLP
Package Code N60M1+1 Outline Number 21-100427 Land Pattern Number Refer to Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 95.15°C/W Junction to Case (θJC) 56°C/W
TDFN
Package Code T822+3C Outline Number 21-0168 Land Pattern Number 90-0065
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 85.3°C/W Junction to Case (θJC) 8.9°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = +1.5V, GND = 0, VCM = VDD/2, RLOAD = 10kΩ to VDD/2, VSHDN = VDD, TA = -40°C ≤ TA ≤ +125°C unless otherwise noted. Typical values are at +25°C.(Note 1))
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC SPECIFICATIONS
0°C ≤ TA ≤ +85°C 1 10 Input Offset Voltage VOS μV -40°C ≤ TA ≤ +125°C 25 Input Offset Voltage Drift ∆VOS 25 nV/°C -40°C ≤ TA ≤ +85°C 55 200 Input Bias Current IB (Note 2) pA -40°C ≤ TA ≤ +125°C 400 Input Offset Current IOS 110 pA Input Common-Mode V V DD + V Range CM Guaranteed by CMRR test -0.1 0.1 19-100763 www.maximintegrated.com Maxim Integrated | 3 Document Outline General Description Applications Benefits and Features Typical Application Circuit Absolute Maximum Ratings Package Information WLP TDFN Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configurations WLP TDFN Pin Description Pin Description (continued) Detailed Description Auto-Zero Shutdown Operation Applications Information Overview Power-Up Settling Time Capacitive-Load Stability Power Supplies and Layout Ordering Information Revision History