Datasheet SFH 421 (OSRAM) - 7
Manufacturer | OSRAM |
Description | GaAlAs Infrared Emitter in SMT Package |
Pages / Page | 7 / 7 — SFH 421, SFH 426. Löthinweise Soldering Conditions. Bauform. Tauch-, … |
File Format / Size | PDF / 88 Kb |
Document Language | English |
SFH 421, SFH 426. Löthinweise Soldering Conditions. Bauform. Tauch-, Schwall- und Schlepplötung. Reflowlötung. Types

Model Line for this Datasheet
Text Version of Document
SFH 421, SFH 426 Löthinweise Soldering Conditions Bauform Tauch-, Schwall- und Schlepplötung Reflowlötung Types Dip, Wave and Drag Soldering Reflow Soldering Lötbad- Maximal Abstand Lötzonen- Maximale temperatur zulässige Lötstelle – temperatur Durchlaufzeit Lötzeit Gehäuse Temperature Max. Perm. Distance Temperature Max. Transit of the Soldering between of Soldering Time Soldering Time Solder Joint Zone Bath and Case
TOPLED® 260 °C 8 s – 245 °C 10 s SIDELED 260 °C 8 s – 245 °C 10 s Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us.
Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please!
The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2002-03-14 7