Datasheet SQJA80EP (Vishay)

ManufacturerVishay
DescriptionAutomotive N-Channel 80 V (D-S) 175 °C MOSFET
Pages / Page10 / 1 — SQJA80EP. Automotive N-Channel 80 V (D-S) 175 °C MOSFET. FEATURES. …
File Format / SizePDF / 380 Kb
Document LanguageEnglish

SQJA80EP. Automotive N-Channel 80 V (D-S) 175 °C MOSFET. FEATURES. PowerPAK® SO-8L Single. PRODUCT SUMMARY. ORDERING INFORMATION

Datasheet SQJA80EP Vishay

Model Line for this Datasheet

Text Version of Document

SQJA80EP
www.vishay.com Vishay Siliconix
Automotive N-Channel 80 V (D-S) 175 °C MOSFET FEATURES PowerPAK® SO-8L Single
• TrenchFET® power MOSFET • AEC-Q101 qualified • 100 % Rg and UIS tested D • Material categorization: 1 for definitions of compliance please see 6.15 mm 2 S www.vishay.com/doc?99912 S 3 S D 4 1 5.13 mm G Top View Bottom View
PRODUCT SUMMARY
VDS (V) 80 G RDS(on) (Ω) at VGS = 10 V 0.0070 RDS(on) (Ω) at VGS = 4.5 V 0.0100 I N-Channel MOSFET D (A) 60 Configuration Single S
ORDERING INFORMATION
Package PowerPAK SO-8L SQJA80EP-T1 Lead (Pb)-free and halogen-free (for detailed order number please see www.vishay.com/doc?79771)
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS 80 V Gate-source voltage VGS ± 20 TC = 25 °C a 60 Continuous drain current ID TC = 125 °C 39 Continuous source current (diode conduction) a IS 60 A Pulsed drain current b IDM 120 Single pulse avalanche current IAS 35 L = 0.1 mH Single pulse avalanche energy EAS 61 mJ TC = 25 °C 68 Maximum power dissipation b PD W TC = 125 °C 22 Operating junction and storage temperature range TJ, Tstg -55 to +175 °C Soldering recommendations (peak temperature) d, e 260
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount c RthJA 68 °C/W Junction-to-case (drain) RthJC 2.2
Notes
a. Package limited b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 % c. When mounted on 1" square PCB (FR4 material) d. See solder profile (www.vishay.com/doc?73257) The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components S22-0167-Rev. B, 14-Feb-2022
1
Document Number: 75519 For technical questions, contact: automostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000