link to page 2 link to page 2 link to page 2 link to page 3 link to page 2 link to page 3 MBRS240LT3G, NRVBS240LT3G, NRVBS240LNMAXIMUM RATINGSRatingSymbolValueUnit Peak Repetitive Reverse Voltage VRRM 40 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IO A (At Rated VR, TC = 100°C) 2.0 Peak Repetitive Forward Current IFRM A (At Rated VR, Square Wave, 20 kHz, TC = 105°C) 4.0 Non−Repetitive Peak Surge Current IFSM A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 25 Storage Temperature Tstg, TC −55 to +150 °C Operating Junction Temperature TJ −55 to +150 °C Voltage Rate of Change dv/dt V/ms (Rated VR, TJ = 25°C) 10,000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICSCharacteristicSymbolValueUnit Thermal Resistance, Junction−to−Lead (Note 1) RqJL 18 °C/W Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 78 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. ELECTRICAL CHARACTERISTICSCharacteristicSymbolValueUnit Maximum Instantaneous Forward Voltage (Note 3) VF TJ = 25 ° CTJ = 125 ° C V see Figure 2 (I 0.43 0.375 F = 2.0 A) (I 0.54 0.55 F = 4.0 A) Maximum Instantaneous Reverse Current (Note 3) IR TJ = 25 ° CTJ = 100 ° C mA see Figure 4 (V 2.0 60 R = 40 V) (V 0.5 40 R = 20 V) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%. www.onsemi.com2