Datasheet SN74LVC2G14 (Texas Instruments) - 10
| Manufacturer | Texas Instruments |
| Description | Dual Schmitt-Trigger Inverter |
| Pages / Page | 24 / 10 — SN74LVC2G14. www.ti.com. Typical Application (continued). 9.2.3 … |
| Revision | O |
| File Format / Size | PDF / 1.1 Mb |
| Document Language | English |
SN74LVC2G14. www.ti.com. Typical Application (continued). 9.2.3 Application Curve. Figure 5. ICC vs Frequency
Text Version of Document
SN74LVC2G14
SCES200O – APRIL 1999 – REVISED AUGUST 2015
www.ti.com Typical Application (continued) 9.2.3 Application Curve
10 Icc 1.8V 9 Icc 2.5V 8 Icc 3.3V Icc 5V 7 6 - mA 5 Icc 4 3 2 1 0 0 20 40 60 80 Frequency - MHz D003
Figure 5. ICC vs Frequency 10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, TI recommends a 0.1-μF capacitor. If there are multiple VCC pins, then TI recommends a 0.01-μF or 0.022-μF capacitor for each power pin. It is ok to parallel multiple bypass capacitors to reject different frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results.
11 Layout 11.1 Layout Guidelines
When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input terminals should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. The following rules must be observed under all circumstances: • All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. • The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC whichever make more sense or is more convenient. 10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Switching Characteristics, –40°C to 85°C 6.7 Switching Characteristics, –40°C to 125°C 6.8 Operating Characteristics 6.9 Typical Characteristics 7 Parameter Measurement Information 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Support Translation Down (5 V to 3.3 V; 3.3 V to 1.8 V) 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Community Resources 12.2 Trademarks 12.3 Electrostatic Discharge Caution 12.4 Glossary 13 Mechanical, Packaging, and Orderable Information
SCES200O – APRIL 1999 – REVISED AUGUST 2015
www.ti.com Typical Application (continued) 9.2.3 Application Curve
10 Icc 1.8V 9 Icc 2.5V 8 Icc 3.3V Icc 5V 7 6 - mA 5 Icc 4 3 2 1 0 0 20 40 60 80 Frequency - MHz D003
Figure 5. ICC vs Frequency 10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, TI recommends a 0.1-μF capacitor. If there are multiple VCC pins, then TI recommends a 0.01-μF or 0.022-μF capacitor for each power pin. It is ok to parallel multiple bypass capacitors to reject different frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results.
11 Layout 11.1 Layout Guidelines
When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input terminals should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. The following rules must be observed under all circumstances: • All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. • The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC whichever make more sense or is more convenient. 10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Switching Characteristics, –40°C to 85°C 6.7 Switching Characteristics, –40°C to 125°C 6.8 Operating Characteristics 6.9 Typical Characteristics 7 Parameter Measurement Information 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Support Translation Down (5 V to 3.3 V; 3.3 V to 1.8 V) 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Community Resources 12.2 Trademarks 12.3 Electrostatic Discharge Caution 12.4 Glossary 13 Mechanical, Packaging, and Orderable Information
