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Package Intersil M14.173A

Package Intersil M14.173A

ManufacturerIntersil
SeriesTSSOP
Part NumberM14.173A

14 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M14.173A
    14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 2, 10/09
    A
    1 3
    3.20 В±0.10 5.00 В±0.10
    14 SEE
    DETAIL "X" 8 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2 3.00 В±0.10 3 1 7 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09-0.20
    END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
    0.05 H
    C 0.90 +0.15/-0.10
    1.20 MAX SEATING
    PLANE GAUGE
    PLANE
    0.25 +0.05/-0.06 0.10 C 0.10 0.25 5
    0В°-8В° 0.05 MIN
    0.15 MAX CBA SIDE VIEW 0.60 В±0.15 DETAIL "X"
    (3.20) NOTES:
    (1.45) 1. Dimension does not include mold flash, protrusions or gate burrs. ...

Parametrics

FamilyTSSOP-EP
Pin Count14
Length5.00 mm
Height max1.05 mm
Weight0.054 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM14.173A

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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