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Package Intersil M14.173B

Package Intersil M14.173B

ManufacturerIntersil
SeriesTSSOP
Part NumberM14.173B

14 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M14.173B
    14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 1, 1/10
    A
    1 3
    3.10 В±0.10 5.00 В±0.10
    8 14 SEE
    DETAIL "X" 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2 3.00 В±0.10 3 0.20 C B A
    1 7
    B 0.65 EXPOSED THERMAL PAD 0.15 +0.05/-0.06 BOTTOM VIEW END VIEW TOP VIEW 1.00 REF H
    0.05
    C
    1.20 MAX SEATING
    PLANE
    0.25 +0.05/-0.06
    0.10 C 0.10 0.90 +0.15/-0.10
    GAUGE
    PLANE 5 0.25 CBA
    0В°-8В° 0.05 MIN ...

Parametrics

FamilyTSSOP-EP
Pin Count14
Height max1.05 mm
Weight0.054 g
Pitch0.65 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM14.173B

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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