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Package Intersil M20.173A

Package Intersil M20.173A

ManufacturerIntersil
SeriesTSSOP
Part NumberM20.173A

20 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M20.173A
    20 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 1, 10/15
    A
    1 3 6.50 В±0.10 3.000 В±0.1 6.40 PIN #1
    I.D. MARK 4.40 В±0.10
    2 4.19 В±0.10 SEE DETAIL "X"
    10 20 3 EXPOSED
    THERMAL PAD 0.20 C B A 1 9
    B 0.65 0.09-0.20 TOP VIEW END VIEW BOTTOM VIEW 1.00 REF
    H -0.05 C
    1.20 MAX SEATING
    PLANE 0.90 +0.15/-0.10
    GAUGE
    PLANE 0.25 +0.05/-0.06 5
    0.10 M C B A 0.10 C 0 MIN TO 0.15 MAX
    SIDE VIEW 0.60 В±0.15 0.25 0В°-8В° DETAIL "X" (4.19) (1.45) NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. (5.65) (3.00) 2. Dimension does not include interlead flash or protrusion. Interlead
    flash or protrusion shall not exceed 0.25 per side.
    3. Dimensions are measured at datum plane H.
    4. Dimensioning and tolerancing per ASME Y14.5M-1994. ...

Parametrics

FamilyTSSOP-EP
Pin Count20
Length6.50 mm
Weight0.072 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM20.173A

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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