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Package Intersil M24.173D

Package Intersil M24.173D

ManufacturerIntersil
SeriesTSSOP
Part NumberM24.173D

24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M24.173D
    24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
    Rev 0, 10/09
    A
    1 3
    5.49 В±0.10 7.80 В±0.10
    SEE
    DETAIL "X" 13 24 6.40
    PIN #1
    I.D. MARK 4.40 В±0.10
    2
    3 1 3.00 В±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09 -0.20
    END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
    H
    0.05 C 0.90 +0.15/-0.10
    1.20 MAX GAUGE
    PLANE SEATING PLANE
    0.19 -0.30 5
    0.10 CBA 0.10C 0В°-8В°
    0.60 В±0.15 0.00 MIN
    0.10 MAX SIDE VIEW 0.25 DETAIL "X" (5.49) (1.45) NOTES:
    1. Dimension does not include mold flash, protrusions or gate burrs. ...

Parametrics

FamilyTSSOP-EP
Pin Count24
Length7.80 mm
Weight0.09 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM24.173D

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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