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Package Intersil M24.173D

24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)

Package Outline Drawing (POD)

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  Plastic Packages for Integrated Circuits Package Outline Drawing
  M24.173D
  24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
  Rev 0, 10/09
  A
  1 3
  5.49 ±0.10 7.80 ±0.10
  SEE
  DETAIL "X" 13 24 6.40
  PIN #1
  I.D. MARK 4.40 ±0.10
  2
  3 1 3.00 ±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09 -0.20
  END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
  H
  0.05 C 0.90 +0.15/-0.10
  1.20 MAX GAUGE
  PLANE SEATING PLANE
  0.19 -0.30 5
  0.10 CBA 0.10C 0°-8°
  0.60 ±0.15 0.00 MIN
  0.10 MAX SIDE VIEW 0.25 DETAIL "X" (5.49) (1.45) NOTES:
  1. Dimension does not include mold flash, protrusions or gate burrs. ...

Parametrics

Moldel Line

• M14.173 M14.173A M14.173B M16.173 M16.173A M20.173 M20.173A M24.173 M24.173B M24.173C M24.173D M28.173 M28.173A M28.173B M38.173 M38.173B M38.173C M48.240 M8.173 MDP0044 MDP0048

Manufacturer's Classification

• Plastic Packages

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• Package Intersil M24.173
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