Package Intersil M24.173D
24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)
Package Outline Drawing (POD)
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M24.173D
24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 0, 10/09
A
1 3
5.49 В±0.10 7.80 В±0.10
SEE
DETAIL "X" 13 24 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2
3 1 3.00 В±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09 -0.20
END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
H
0.05 C 0.90 +0.15/-0.10
1.20 MAX GAUGE
PLANE SEATING PLANE
0.19 -0.30 5
0.10 CBA 0.10C 0В°-8В°
0.60 В±0.15 0.00 MIN
0.10 MAX SIDE VIEW 0.25 DETAIL "X" (5.49) (1.45) NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs. ...
Parametrics
| Family | TSSOP-EP |
|---|---|
| Pin Count | 24 |
| Length | 7.80 mm |
| Weight | 0.09 g |
| Peak Temperature | 240 °C |
| Lead Free Peak Temperature | 260 °C |
| Features | Exposed Pad |
| Package Index | M24.173D |
Moldel Line
Series: TSSOP (21)- M14.173 M14.173A M14.173B M16.173 M16.173A M20.173 M20.173A M24.173 M24.173B M24.173C M24.173D M28.173 M28.173A M28.173B M38.173 M38.173B M38.173C M48.240 M8.173 MDP0044 MDP0048
Manufacturer's Classification
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