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Package Intersil M28.173

Package Intersil M28.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM28.173

28 Lead Thin Shrink Small Outline Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M28.173
    28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 1, 5/10
    A
    9.70В± 0.10 1 3
    SEE DETAIL "X"
    15 28 6.40
    PIN #1
    I.D. MARK 4.40 В± 0.10
    2 3 0.20 C B A 1 14 0.15 +0.05
    -0.06 B 0.65
    TOP VIEW END VIEW 1.00 REF
    H -0.05
    0.90 +0.15
    -0.10 C GAUGE
    PLANE 1.20 MAX
    SEATING PLANE +0.05
    0.25
    5
    -0.06
    0.10 M C B A 0.10 C 0.25 0В°-8В° 0.05 MIN
    0.15 MAX 0.60 В±0.15 SIDE VIEW ...

Parametrics

FamilyTSSOP
Pin Count28
Length9.70 mm
Thickness0.90 mm
Height max1.20 mm
Weight0.107 g
Pitch0.65 mm
Package IndexM28.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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