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Package Intersil M28.173A

Package Intersil M28.173A

ManufacturerIntersil
SeriesTSSOP
Part NumberM28.173A

28 Lead Thin Shrink Small Outline Exposed Pad Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
    M28.173A N
    INDEX
    AREA E 0.25(0.010) M E1 2 L 0.05(0.002)
    -A-A D α
    A2
    c e A1 b
    0.10(0.004) M 0.25
    0.010 SEATING PLANE -C-2 SYMBOL 3
    TOP VIEW 1 INCHES GAUGE
    PLANE -B1 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
    PACKAGE B M 0.10(0.004)
    C A M B S 3 MIN MAX MILLIMETERS
    MIN MAX NOTES A -0.047 -1.20 -A1 0.002 0.006 0.05 0.15 -A2 0.031 0.051 0.80 1.05 9 b 0.0075 0.0118 0.19 0.30 c 0.0035 0.0079 0.09 0.20 -D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC 0.65 BSC -E 0.246 0.256 6.25 6.50 -L 0.0177 0.0295 0.45 0.75 6 α 0o 8o 0o 8o -P -0.138 -3.50 11 P1 -0.118 -3.0 11 N 28 28 7 NOTES:
    Rev. 1 6/99
    1. These package dimensions are within allowable dimensions
    of JEDEC MO-153-AET, Issue E.
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
    3. Dimension “D” does not include mold flash, protrusions or
    gate burrs. Mold flash, protrusion and gate burrs shall not
    exceed 0.15mm (0.006 inch) per side.
    4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed ...

Parametrics

FamilyTSSOP-EP
Pin Count28
Length9.70 mm
Weight0.107 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesExposed Pad
Package IndexM28.173A

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages

Related datasheets:

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