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Package Intersil M8.173

Package Intersil M8.173

ManufacturerIntersil
SeriesTSSOP
Part NumberM8.173

8 Lead Thin Shrink Small Outline Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    M8.173
    8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
    Rev 2, 01/10
    A
    2 4 3.0 В±0.5
    SEE DETAIL "X" 5 8 6.40
    CL 4.40 В±0.10
    3 4 PIN 1
    ID MARK
    0.20 C BA 1 4
    0.09-0.20 B 0.65
    TOP VIEW END VIEW 1.00 REF
    0.05 H
    C 0.90 +0.15/-0.10
    1.20 MAX SEATING
    PLANE
    0.25 +0.05/-0.06
    0.10 C 0.10 GAUGE
    PLANE 0.25 6 CBA 0В°-8В° 0.05 MIN
    0.15 MAX 0.60 В±0.15
    DETAIL "X" SIDE VIEW (1.45) NOTES:
    1. Dimensions are in millimeters. ...

Parametrics

FamilyTSSOP
Pin Count8
Length3.00 mm
Height max1.05 mm
Weight0.033 g
Pitch0.65 mm
Lead Free Peak Temperature260 °C
Package IndexM8.173

Moldel Line

Series: TSSOP (21)

Manufacturer's Classification

  • Plastic Packages
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