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Package Intersil W11x11.121B

Package Intersil W11x11.121B

ManufacturerIntersil
SeriesWLCSP
Part NumberW11x11.121B

121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W11x11.121B
    121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm pitch)
    Rev 0, 2/14
    5.526В±0.030 X
    0.500 Y
    121x 0.320В±0.030 L
    K
    J
    H
    G 5.540В±0.030 F
    E
    D
    C
    B 0.270 A
    (4X) 1 0.10 2 3 4 5 6 7 8 9 10 11
    0.263 0.500 PIN 1
    TOP VIEW BOTTOM VIEW Z SEATING PLANE
    0.05 Z PACKAGE OUTLINE 0.330 0.500 0.320В±0.030 121x 0.10 M Z X Y
    0.05 M Z 0.280
    0.240В±0.030
    0.600В±0.060 3 NSMD
    TYPICAL RECOMMENDED LAND PATTERN NOTES: ...
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