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Package Intersil W2x2.4

Package Intersil W2x2.4

ManufacturerIntersil
SeriesWLCSP
Part NumberW2x2.4

4 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W2x2.4
    4 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 3, 5/15 X 0.975
    В±0.020 Y 0.400 B 1.155
    В±0.020
    4x 0.265В±0.035
    (4x) 0.10 PIN 1
    (A1 CORNER) 0.3775 A 1 2 0.2875 TOP VIEW BOTTOM VIEW Z
    0.05 Z SEATING PLANE
    3 PACKAGE OUTLINE
    0.240 0.265В±0.035 x4
    0.10
    0.05 0.400 ZXY
    Z 0.290 0.200В±0.030 TYPICAL RECOMMENDED LAND PATTERN
    0.500В±0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5-1994 and JESD 95-1
    SPP-010.
    3. NSMD refers to non-solder mask defined pad design per Intersil
    Techbrief www.intersil.com/data/tb/tb451.pdf 1 ...
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