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Package Intersil W3x2.6C

Package Intersil W3x2.6C

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x2.6C

3x2 Array 6 Ball Wafer Level CSP (for ISL28138C, ISL28136C, EL8176, EL8178)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Wafer Level Chip Scale Package (WLCSP) W3x2.6C
    3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE E D
    PIN 1 ID
    TOP VIEW A2
    A
    A1 SYMBOL MILLIMETERS A 0.51 Min, 0.55 Max A1 0.225 В±0.015 A2 0.305 В±0.013 b О¦0.323 В±0.025 D 0.955 В±0.020 D1 0.50 BASIC E 1.455 В±0.020 E1 1.00 BASIC e 0.50 BASIC SD 0.25 BASIC SE 0.00 BASIC
    Rev. 3 03/08 b NOTES:
    SIDE VIEW 1. All dimensions are in millimeters. E1
    e
    SE D1 2 SD 1
    b C B A BOTTOM VIEW 1 ...
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