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Package Intersil W3x2.6D

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x2.6D

6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x2.6D
    6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
    Rev 2, 8/15 X 0.400 1.360В±0.030 Y 0.400 2
    0.865В±0.030
    6x 0.265В±0.035
    (2X) 1
    C 0.10
    PIN 1
    (A1 CORNER) B A
    0.233 0.400 0.280 TOP VIEW
    BOTTOM VIEW Z SEATING PLANE 0.05 Z 3 PACKAGE OUTLINE
    0.240
    0.040 BSC
    (BACKSIDE COATING) 0.400 0.265В±0.035 0.290 4 0.10 M Z X Y
    0.05 M Z 6 NSMD
    0.200В±0.030 RECOMMENDED LAND PATTERN
    0.540В±0.050
    SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical ...
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