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Package Intersil W3x3.9C

Package Intersil W3x3.9C

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9C

3x3 Array 9 Ball Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Wafer Level Chip Scale Package
    (WLCSP 0.4mm Ball Pitch) W3x3.9C
    3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE E D PIN 1
    INDEX AREA TOP VIEW SYMBOL MILLIMETERS A 0.445 Min, 0.495 Nom, 0.545 Max A1 0.190 В±0.025 A2 0.305 В±0.025 b 0.270 В±0.030 D 1.315 В±0.020 D1 0.800 BASIC E 1.535 В±0.020 E1 0.800 BASIC e 0.400 BASIC SD 0 BASIC SE
    A2 0 BASIC
    Number of Bumps: 9 A Rev. 0 5/08
    A1 NOTES: b 1. Dimensions are in Millimeters. SIDE VIEW E1
    SD SE
    3
    e
    2
    1 D1
    C B A BOTTOM VIEW 1 b ...
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