RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil W4x4.16

Package Intersil W4x4.16

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x4.16

4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

  • Download », PDF, 121 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x4.16
    4X4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 6/10
    X 1.965±0.02 Y 1.20 16X 0.270 ± 0.025 LOGO ID
    4
    3
    1.20 1.815±0.02
    PIN 1 2
    0.40
    1
    0.10 D (4X) TOP VIEW A
    C
    B
    BOTTOM VIEW 0.305 ± 0.025 0.535 mm MAX 0.10 Z 0.27 ± 0.025 Z SEATING PLANE Ø0.10 M Z X Y
    Ø0.05 M Z 0.19 ± 0.015 0.05 Z SIDE VIEW 0.275 PACKAGE
    OUTLINE NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5M-1994,
    and JESD 95-1 SPP-010.
    3. NSMD refers to Non-solder Mask Defined pad design per
    Intersil Tech Brief TB451 located at:
    http://www.intersil.com/data/tb/tb451.pdf. ...
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus