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Package Intersil W4x4.16B

Package Intersil W4x4.16B

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x4.16B

4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x4.16B
    4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 2, 8/13
    PIN 1
    (A1 CORNER) X 1.200
    0.400 1.655±0.03 Y D
    0.400
    16X 0.265±0.035 C
    1.200 1.655±0.03
    B 0.228 A
    (4X) 4 0.10
    TOP VIEW 3 2 1 0.295
    0.200
    0.228
    BOTTOM VIEW Z
    PACKAGE
    OUTLINE 0.10 Z SEATING PLANE
    3 0.290 2
    0.265±0.035
    √Ш0.10 M Z X Y
    √Ш0.05 M Z
    4 0.400 0.240 ...
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